Reinforcement of lead bonding in microelectronics packages

A microelectronics package, comprising:

• a microelectronics device having a bond pad;
• a conductive lead having a first end directly bonded to the bond pad to form a lead bond;
• a reinforcement portion at least partially disposed about the lead bond and a first portion of the conductive lead proximate to the first end, wherein the first end and the bond pad are substantially encapsulated by the reinforcement portion;
• and
• an encapsulating material at least partially disposed about the reinforcement portion and a second portion of the conductive lead not having the reinforcement portion disposed thereabout,
• the reinforcement portion having a greater bond strength than the encapsulating material.

A microelectronics package, comprising:

• a microelectronics device having a plurality of bond pads;
• a plurality of conductive leads each having a first end directly bonded to one of the bond pads to form a plurality of lead bonds;
• an interposer having a plurality of contact pads, each conductive lead having a second end electrically coupled to one of the contact pads;
• a spacing layer having a first surface contacting the microelectronics device and a second surface substantially opposite the first surface and contacting the interposer;
• a reinforcement portion at least partially disposed about the lead bond pads and a first portion of the conductive leads proximate to the first end;
• and
• an encapsulating material at least partially disposed about the reinforcement portion and a second portion of the conductive leads not having the reinforcement portion disposed thereabout,
• the reinforcement portion having a greater modulus of elasticity than the encapsulating material.

A microelectronics package, comprising:

• a microelectronics device having a plurality of bond pads;
• a plurality of conductive leads each having a first end directly bonded to one of the bond pads to form a plurality of lead bonds;
• an interposer having a plurality of contact pads, each conductive lead having a second end electrically coupled to one of the contact pads;
• a spacing layer having a first surface contacting the microelectronics device and a second surface substantially opposite the first surface and contacting the interposer;
• a reinforcement portion at least partially disposed about the lead bond pads and a first portion of the conductive leads proximate to the first end, wherein the first end and the bond pad are substantially encapsulated by the reinforcement portion;
• and
• an encapsulating material at least partially disposed about the reinforcement portion and a second portion of the conductive leads not having the reinforcement portion disposed thereabout,
• the reinforcement portion having a greater bond strength than the encapsulating material.