Semiconductor module having signal assembly in first and second molding compound

A semiconductor module comprising:

• a substrate;
• at least one chip disposed on the substrate and electrically connected to the substrate;
• at least one signal assembly disposed on the substrate in a normal direction of the substrate and electrically connected to the substrate;
• a first molding compound disposed on the substrate, the first molding compound at least covering the at least one chip and having at least one opening, and the at least one opening exposing the at least one signal assembly;
• and
• a second molding compound disposed on the substrate and filling the at least one opening, the second molding compound located between the at least one signal assembly and the first molding compound and covering the at least one signal assembly, wherein at least one contact interface is formed between the second molding compound and the first molding compound,
• wherein the at least one signal assembly comprises:
• at least one power semiconductor package signal connection element disposed on the substrate, wherein the first molding compound exposes the at least one power semiconductor package signal connection element;
• and
• at least one implanted signal pin inserted into the at least one power semiconductor package signal connection element in a direct contact with the substrate, wherein the second molding compound covers the at least one power semiconductor package signal connection element and a portion of the at least one implanted signal pin.