H10W 90/769
Between a chip and a laterally-adjacent discrete passive device
Official title: {between a chip and a laterally-adjacent discrete passive device}
H10W90/769 (Between a chip and a laterally-adjacent discrete passive device) appears on 13 US grants and 16 published applications in this corpus.
Search patents in H10W- Granted patents
- 13
- Published applications
- 16
- Assignees
- 12
- Inventors
- 42
- Latest grant
- 1 Apr 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2017 | 1 | 2 |
| 2018 | 1 | 1 |
| 2019 | 1 | 2 |
| 2020 | 4 | 5 |
| 2021 | 0 | 2 |
| 2022 | 2 | 2 |
| 2023 | 1 | 0 |
| 2024 | 1 | 0 |
| 2025 | 2 | 2 |
By publication year.
Recent patents
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- Multi-die package with multiple heat channels24 Dec 2024US 12,176,274 B2Texas Instruments Incorporated
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- Semiconductor package14 Aug 2025US 2025/0259942 A1Samsung Electronics Co., Ltd.
- Method for producing a circuit arrangement for an electric machine, power semiconductor module for a circuit arrangement, and corresponding circuit arrangement3 Apr 2025US 2025/0112214 A1
- Semiconductor packages with vertical passive components30 Jun 2022US 2022/0208746 A1UTAC Headquarters Pte. Ltd.
- Voltage-Controlled Switching Device with Resistive Path31 Mar 2022US 2022/0102478 A1Infineon Technologies Dresden GmbH
- Method for connecting components during production of power electronic modules or assemblies30 Sep 2021US 2021/0305197 A1Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e. V.
Most cited
By later US patents
- PCB based semiconductor package having integrated electrical functionality6US 9,629,246 B2Infineon Technologies AG · 2017
- Semiconductor module2US 10,325,895 B2Mitsubishi Electric Corporation · 2019
- Trench capacitor with warpage reduction2US 10,559,650 B2Texas Instruments Incorporated · 2020
- Packaged semiconductor system having unidirectional connections to discrete components1US 10,566,276 B2Texas Instruments Incorporated · 2020