PCB based semiconductor package having integrated electrical functionality

A semiconductor package, comprising:

• a metal baseplate;
• a semiconductor die having a reference terminal attached to the baseplate and an RF terminal facing away from the baseplate;
• a multilayer circuit board having a first side attached to the baseplate and a second side facing away from the baseplate, the multilayer circuit board comprising a plurality of interleaved signal and ground layers, one of the signal layers being at the second side of the multilayer circuit board and electrically connected to the RF terminal of the semiconductor die, one of the ground layers being at the first side of the multilayer circuit board and attached to the metal baseplate;
• power distribution structures formed in the signal layer at the second side of the multilayer circuit board;
• and
• RF matching structures formed in a different one of the signal layers than the power distribution structures.

A semiconductor assembly, comprising:

• a substrate;
• and
• a semiconductor package attached to the substrate and comprising:
• a metal baseplate;
• a semiconductor die having a reference terminal attached to the baseplate and an RF terminal facing away from the baseplate;
• a multilayer circuit board having a first side attached to the baseplate and a second side facing away from the baseplate, the multilayer circuit board comprising a plurality of interleaved signal and ground layers, one of the signal layers being at the second side of the multilayer circuit board and electrically connected to the RF terminal of the semiconductor die, one of the ground layers being at the first side of the multilayer circuit board and attached to the metal baseplate;
• power distribution structures formed in the signal layer at the second side of the multilayer circuit board;
• and
• RF matching structures formed in a different one of the signal layers than the power distribution structures.