Semiconductor module
AssigneeMitsubishi Electric Corporation
InventorKenta Nakahara
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Abstract
It is an object of the present invention to provide a semiconductor module in which a bonded portion has high reliability, and that has a small area. A semiconductor module includes a plurality of metal plates extending in a horizontal direction and stacked in a vertical direction, at least one switching element, and at least one circuit element. The at least one switching element is bonded between two of the plurality of metal plates, facing each other in a vertical direction. The at least one circuit element is bonded between two of the plurality of metal plates, facing each other in a vertical direction. Disposed between the plurality of metal plates is an insulating material. At least one of the plurality of metal plates is bonded to the at least one switching element and the at least one circuit element.
Claims17
A semiconductor module comprising:
- a plurality of metal plates extending in a horizontal direction and stacked in a vertical direction;
- at least one switching element;
- and
- at least one circuit element, wherein
- said at least one switching element is bonded between two of said plurality of metal plates, facing each other in a vertical direction,
- said at least one circuit element is bonded between two of said plurality of metal plates, facing each other in a vertical direction,
- an insulating material is disposed between said plurality of metal plates, and
- at least one of said plurality of metal plates is bonded to said switching element and said circuit element.
Dependencies are inferred from the claim text.