Packaged semiconductor system having unidirectional connections to discrete components

A semiconductor package comprising:

• a substrate;
• a semiconductor die attached to, and electrically connected to the substrate;
• and
• a capacitor on the semiconductor die, the capacitor including a first electrode attached to the semiconductor die, a second electrode electrically coupled to the semiconductor die, and a sheet of capacitive elements between the first electrode and the second electrode, the first electrode extending laterally from a side wall of the sheet of capacitive elements, and electrically coupled to the substrate.

A semiconductor package comprising:

• a substrate;
• a semiconductor die attached to, and electrically connected to the substrate;
• a capacitor including a first electrode attached to the substrate, a second electrode electrically coupled to the semiconductor die, and a sheet of capacitive elements between the first electrode and the second electrode, the first electrode extending laterally from a side wall of the sheet of capacitive elements, and electrically coupled to the substrate;
• an insulative layer covering the side wall;
• and
• molding compound covering portions of the substrate, the semiconductor die, the capacitor, and the insulative layer.