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US 12,176,274 B2Granted
Multi-die package with multiple heat channels
AssigneeTexas Instruments Incorporated
InventorsJonathan Almeria Noquil, Osvaldo Jorge Lopez, Tianyi Luo
Life of this patent
Estimating the term…
Abstract
A semiconductor package comprises a first die thermally coupled to a first thermally conductive device. The first thermally conductive device has a first surface exposed to an exterior of the semiconductor package. The package comprises a second die thermally coupled to a second thermally conductive device, the second thermally conductive device having a second surface exposed to an exterior of the semiconductor package. The first and second dies are positioned in different horizontal planes.
Claims17
A semiconductor package, comprising:
- a die attach pad, a first lead, and a second lead;
- a first die attached to the die attach pad;
- a first die attach clip attached to the first die and to the first lead;
- a first heat slug, extending from the first die attach clip, with a portion of the first heat slug exposed on an exterior surface of the semiconductor package;
- a second die directly attached to the first die attach clip;
- a second die attach clip attached to the second die and to the second lead;
- and
- a second heat slug attached to the second die attach clip, the second heat slug extending from the second die attach clip, with a portion of the second heat slug exposed on the exterior surface;
- wherein the second die is completely above the first die from a cross-sectional view of the semiconductor package, wherein a cross-sectional length of the second die completely aligns with a cross-sectional length of the first die in a vertical direction, the vertical direction perpendicular to a plane along the exterior surface, and wherein the exterior surface of the semiconductor package is at a top in the cross-sectional view of the semiconductor package.
6 more elements
A semiconductor package, comprising:
- a first lead, a second lead, and a die pad;
- a first die positioned on the die pad;
- a first thermally conductive device coupling the first die to the first lead, the first thermally conductive device having a first surface that is approximately flush with a surface of the semiconductor package;
- a second die directly attached to the first thermally conductive device;
- and
- a second thermally conductive device coupling the second die to the second lead, the second thermally conductive device having a second surface that is flush with the surface of the semiconductor package, the second die completely above the first die from a cross-sectional view of the semiconductor package, where a bottom side of the semiconductor package including the die pad is at a bottom in the cross-sectional view;
- wherein a cross-sectional length of the second die completely aligns with a cross-sectional length of the first die in a vertical direction, the vertical direction perpendicular to a plane along the surface;
- and wherein the cross-sectional length of the second die is less than the cross-sectional length of the first die.
5 more elements
Dependencies are inferred from the claim text.