H10W 90/762
Between stacked chips
Official title: {between stacked chips}
H10W90/762 (Between stacked chips) appears on 36 US grants and 57 published applications in this corpus.
Search patents in H10W- Granted patents
- 36
- Published applications
- 57
- Assignees
- 33
- Inventors
- 142
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 1 | 0 |
| 2012 | 0 | 2 |
| 2013 | 2 | 0 |
| 2014 | 1 | 5 |
| 2015 | 5 | 3 |
| 2016 | 5 | 4 |
| 2017 | 1 | 0 |
| 2018 | 0 | 0 |
| 2019 | 1 | 3 |
| 2020 | 1 | 5 |
| 2021 | 5 | 4 |
| 2022 | 2 | 5 |
| 2023 | 3 | 0 |
| 2024 | 2 | 3 |
| 2025 | 3 | 10 |
| 2026 | 4 | 12 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Sensor packages11 Aug 2026US 12,708,034 B2Texas Instruments Incorporated
- Multi-die integrated circuit device with a spark gap14 Jul 2026US 12,685,188 B2Allegro MicroSystems, LLC
- Isolated metal clips with structural bridge14 Jul 2026US 12,685,193 B2Analog Devices, Inc.
- Integrated cooling assemblies for advanced device packaging and methods of manufacturing the same21 Apr 2026US 12,610,819 B2Adeia Semiconductor Bonding Technologies Inc.
- Clip structure for semiconductor package and semiconductor package including the same26 Aug 2025US 12,400,991 B2JMJ Korea Co., Ltd.
- Isolated metal clips with structural bridge8 Oct 2026US 2026/0314452 A1Analog Devices, Inc.
- Semiconductor package8 Oct 2026US 2026/0314508 A1Samsung Electronics Co., Ltd.
- Method of manufacturing semiconductor devices and corresponding semiconductor device3 Sep 2026US 2026/0262526 A1STMicroelectronics International N. V.
- Packaged device, method for manufacturing, and lead frame27 Aug 2026US 2026/0255985 A1NXP USA, Inc.
- Semiconductor package2 Jul 2026US 2026/0191009 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Integrating multi-output power converters having vertically stacked semiconductor chips33US 9,214,415 B2Texas Instruments Incorporated · 2015
- Integrating multi-output power converters having vertically stacked semiconductor chips19US 9,373,571 B2Texas Instruments Incorporated · 2016
- Stacked leadframe implementation for DC/DC convertor power module incorporating a stacked controller and stacked leadframe construction methodology14US 8,450,149 B2Texas Instruments Incorporated · 2013
- Pressure sensor package having a stacked die arrangement8US 9,013,013 B1Infineon Technologies AG · 2015
- Semiconductor package with solder standoff3US 11,177,197 B2Texas Instruments Incorporated · 2021