Clip structure for semiconductor package and semiconductor package including the same

A semiconductor package comprising:

• a lower substrate;
• an upper substrate spaced apart from the lower substrate;
• a semiconductor device formed on the lower substrate;
• a clip structure comprising:
• a first lower bonding unit bonded to an upper surface of the semiconductor device;
• a first connecting unit folded upward extending from an end of the first lower bonding unit;
• a second connecting unit extending from an end of the first connecting unit in a horizontal direction;
• a third connecting unit folded downward extending from an end of the second connecting unit;
• a second lower bonding unit extending from an end of the third connecting unit in the horizontal direction and bonded to the lower substrate;
• an upper bonding unit provided above the second lower bonding unit and bonded to the upper substrate;
• and
• an elastic unit elastically connected between a first end of the upper bonding unit and an end of the second lower bonding unit, the elastic unit having an arch shape;
• a package housing covering the semiconductor device;
• and
• a terminal exposed to an outside of the package housing for electrically connecting to the semiconductor device.

A semiconductor package comprising:

• a lower substrate on which a first semiconductor device is formed;
• an upper substrate spaced apart from the lower substrate, wherein a second semiconductor device is formed on the upper substrate;
• a clip structure comprising:
• a first lower bonding unit bonded to an upper surface of the first semiconductor device;
• a first connecting unit folded upward extending from an end of the first lower bonding unit;
• a second connecting unit extending from an end of the first connecting unit in a horizontal direction;
• a third connecting unit folded downward extending from an end of the second connecting unit;
• a second lower bonding unit extending from an end of the third connecting unit in the horizontal direction and bonded to the lower substrate;
• an upper bonding unit provided above the second lower bonding unit and bonded to a lower surface of the second semiconductor device;
• and
• an elastic unit elastically connected between a first end of the upper bonding unit and an end of the second lower bonding unit, the elastic unit having an arch shape;
• a package housing covering the first semiconductor device and the second semiconductor device;
• and
• a terminal exposed to an outside of the package housing for electrically connecting to the first semiconductor device or the second semiconductor device.

A semiconductor package comprising:

• a lower substrate;
• a semiconductor device formed on the lower substrate;
• a clip structure comprising:
• a first lower bonding unit bonded to an upper surface of the semiconductor device;
• a first connecting unit folded upward and extending from an end of the first lower bonding unit;
• a second connecting unit extending from an end of the first connecting unit in a horizontal direction;
• a third connecting unit folded downward extending from an end of the second connecting unit;
• a second lower bonding unit extending from an end of the third connecting unit in the horizontal direction and bonded to the lower substrate;
• an upper bonding unit provided above the second lower bonding unit;
• and
• an elastic unit elastically connected between a first end of the upper bonding unit and an end of the second lower bonding unit, the elastic unit having an arch shape;
• a package housing covering the semiconductor device;
• and
• a terminal exposed to an outside of the package housing for electrically connecting to the semiconductor device,
• wherein at least a part of an upper surface of the upper bonding unit in the clip structure is not covered with the package housing.