Integrating multi-output power converters having vertically stacked semiconductor chips

An electronic multi-output device comprising:

• a substrate comprising:
• a first pad;
• a second pad;
• a plurality of pins;
• a first chip with a first transistor having a first chip first terminal on one chip surface and a first chip second terminal and a first chip third terminal on an opposite chip surface, the first chip first terminal tied to the first pad;
• a second chip with a second transistor having a second chip first terminal on one chip surface and the second chip second terminal and a second chip third terminal on the opposite chip surface, the second chip first terminal tied to the second pad;
• the first chip second terminal and second chip second terminal connected by a discrete first clip and a discrete second metal clip to respective substrate pins;
• and
• a composite third chip having a third transistor and a fourth transistor integrated so that a first terminal of the third transistor and a first terminal of the fourth transistor are on one chip surface, and a second terminal of the third transistor and a second terminal of the forth transistor merged into a common terminal, and a patterned third terminal of the third transistor and a patterned third terminal of the fourth transistor are on an opposite chip surface;
• the first terminal of the third transistor and the first terminal of the fourth transistor vertically attached to the discrete first clip and the discrete second metal clip, respectively, and the common terminal connected by a common clip to a substrate pin.