Pressure sensor package having a stacked die arrangement

A method of manufacturing a pressure sensor package, the method comprising:

• providing a pressure sensor comprising a first side with a pressure sensor port, a second side opposite the first side, and electrical contacts, and a logic die comprising a first side and a second side opposite the first side with electrical contacts, the logic die operable to process signals from the pressure sensor;
• attaching the first side of the logic die to the second side of the pressure sensor so that the logic die is laterally offset from the electrical contacts of the pressure sensor;
• connecting the electrical contacts of the pressure sensor to the electrical contacts of the logic die via electrical conductors;
• encapsulating the pressure sensor, the logic die and the electrical conductors with molding compound, the molding compound having an opening defining an open passage to the pressure sensor port;
• and
• providing external electrical contacts at a side of the pressure sensor package.

A pressure sensor assembly, comprising:

• a board comprising an insulating member and a plurality of traces insulated from one another by the insulating member;
• and
• a pressure sensor package attached to the board, the pressure sensor package comprising:
• a pressure sensor comprising a first side with a pressure sensor port, a second side opposite the first side, and electrical contacts;
• a logic die stacked on the pressure sensor and comprising a first side attached to the second side of the pressure sensor and a second side opposite the first side with electrical contacts, the logic die laterally offset from the electrical contacts of the pressure sensor and operable to process signals from the pressure sensor;
• electrical conductors connecting the electrical contacts of the pressure sensor to the electrical contacts of the logic die;
• molding compound encapsulating the pressure sensor, the logic die and the electrical conductors, the molding compound having an opening defining an open passage to the pressure sensor port;
• and
• external electrical contacts at a side of the pressure sensor package and connected to at least some of the traces of the board.