Multi-die integrated circuit device with a spark gap
AssigneeAllegro MicroSystems, LLC
InventorsWashington Lamar, Weidong Wang, Maxim Klebanov, Sagar Saxena, Yash Shaileshbhai Patel
Life of this patent
Estimating the term…
Abstract
An integrated circuit package having more than one semiconductor die includes a spark gap to provide a current path designed to protect the device. The spark gap can be provided between an exposed portion of a corner lead and an exposed portion of a tie bar and/or between exposed portions of adjacent leads. The spark gap distance is designed to achieve required ratings for a given application. Stacked and side-by-side die configurations are described.
Claims19
Apparatus comprising:
- a first die having a first power contact and a first ground contact;
- a second die having a second power contact and a second ground contact;
- a lead frame comprising a die attach paddle, a tie bar, and a plurality of leads, wherein the first ground contact is electrically coupled to the die attach paddle and the second ground contact is galvanically isolated from the die attach paddle;
- and
- a package body enclosing the die attach paddle, the first die, and the second die, wherein the tie bar is exposed at a first side of the package body and each of the plurality of leads is exposed at a second side of the package body orthogonal to the first side, wherein a corner lead of the plurality of leads is exposed at the first side of the package body to form a spark gap between the exposed portion of the corner lead and the exposed portion of the tie bar.
Apparatus comprising:
- a first die having a first power contact and a first ground contact;
- a second die having a second power contact and a second ground contact;
- a lead frame comprising a die attach paddle having a tie bar and a plurality of leads, wherein the first ground contact is electrically coupled to the die attach paddle and the second ground contact is galvanically isolated from the die attach paddle;
- and
- a package body enclosing the die attach paddle, the first die, and the second die, wherein at least one of the plurality of leads that is not electrically connected to the first die or to the second die comprises a first portion enclosed by the package body and a second portion exposed outside of the package body, wherein the first portion is wider than the second portion to form a spark gap to an adjacent lead of the plurality of leads.
A method for protecting a multi-die electronic device from electrostatic discharge comprising:
- providing a lead frame with a die attach paddle, a tie bar, and a plurality of leads;
- attaching first and second die to the die attach paddle of the lead frame;
- electrically coupling a ground contact of the first die to the die attach paddle and galvanically isolating the second die from the first die;
- enclosing the first die, the second die, and the die attach paddle with a package body having a first side along where each of the plurality of leads is exposed;
- and
- exposing the tie bar and a corner lead of the plurality of leads along a second side of the package body orthogonal to the first side.
Dependencies are inferred from the claim text.