H10W 90/765
Between a chip and a laterally-adjacent insulating package substrate, interposer or rdl
Official title: {between a chip and a laterally-adjacent insulating package substrate, interposer or RDL}
H10W90/765 (Between a chip and a laterally-adjacent insulating package substrate, interposer or rdl) appears on 24 US grants and 40 published applications in this corpus.
Search patents in H10W- Granted patents
- 24
- Published applications
- 40
- Assignees
- 20
- Inventors
- 83
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2013 | 0 | 1 |
| 2014 | 1 | 0 |
| 2015 | 0 | 3 |
| 2016 | 2 | 2 |
| 2017 | 2 | 2 |
| 2018 | 2 | 2 |
| 2019 | 1 | 1 |
| 2020 | 2 | 1 |
| 2021 | 1 | 7 |
| 2022 | 2 | 1 |
| 2023 | 5 | 3 |
| 2024 | 1 | 11 |
| 2025 | 2 | 6 |
| 2026 | 3 | 0 |
By publication year. 2026 runs to 8 Oct.
Recent patents
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- Direct substrate-side cooling in power device module25 Aug 2026US 12,721,168 B2Semiconductor Components Industries, LLC
- Power module and method for manufacturing same4 Aug 2026US 12,702,030 B2Hyundai Motor Company
- Fingerprint sensor package and smart card having the same6 May 2025US 12,294,000 B2Samsung Electronics Co., Ltd.
- Semiconductor device with a supporting member and bonded metal layers7 Jan 2025US 12,191,223 B2Rohm Co., Ltd.
- Semiconductor device20 Nov 2025US 2025/0359283 A1Mitsubishi Electric Corporation
- Semiconductor device and electric power conversion unit11 Sep 2025US 2025/0285932 A1Rohm Co., Ltd.
- Semiconductor package including heat radiation structure, cooling system applying the semiconductor package, substrate including heat radiation structure and method of manufacturing the substrate29 May 2025US 2025/0174521 A9JMJ Korea Co., Ltd.
- Semiconductor device15 May 2025US 2025/0157892 A1Fuji Electric Co., Ltd.
- Direct Bonded Semiconductor Die Package17 Apr 2025US 2025/0125231 A1Wolfspeed, Inc.
Most cited
By later US patents
- Multichip power semiconductor device5US 8,916,968 B2Infineon Technologies AG · 2014
- Semiconductor device4US 10,028,400 B2Fuji Electric Co., Ltd. · 2018
- Semiconductor module4US 9,397,030 B2Nsk Ltd. · 2016
- Flexible circuit leads in packaging for radio frequency devices2US 9,824,995 B2NXP USA, Inc. · 2017
- Power module based on multi-layer circuit board1US 10,636,732 B2ABB Schweiz AG · 2020