Direct Bonded Semiconductor Die Package
AssigneeWolfspeed, Inc.
InventorsDevarajan Balaraman, Afshin Dadvand, Daniel Ginn Richter
Life of this patent
Estimating the term…
Abstract
Semiconductor device packages are provided. In one example, the semiconductor device package includes a semiconductor die. The semiconductor die includes a wide bandgap semiconductor material. The semiconductor die includes a metallization layer on a surface of the semiconductor die. The semiconductor device package includes a submount. The metallization of the semiconductor die is directly bonded to the submount.
Claims26
A semiconductor device package, comprising:
- a semiconductor die, comprising:
- a wide bandgap semiconductor material;
- and
- a metallization layer on a surface of the semiconductor die;
- a submount;
- and
- wherein the metallization layer of the semiconductor die is directly bonded to the submount.
-5. (canceled)
(canceled)
(canceled)
(canceled)
A semiconductor device package, comprising:
- a semiconductor die, comprising:
- a wide bandgap semiconductor material;
- and
- a metallization layer on a surface of the semiconductor die;
- and
- an aluminum lead frame.
-39. (canceled)
A method of providing a semiconductor device package, the method comprising:
- providing a metallization layer on a surface of a semiconductor die, the semiconductor die comprising a wide bandgap semiconductor;
- and
- directly bonding the metallization layer to a submount using a direct bonding process.
-59. (canceled)
Dependencies are inferred from the claim text.