Power module based on multi-layer circuit board

A power module, comprising:

• at least one power semiconductor device with an electrical top contact area on a top side;
• a multi-layer circuit board with multiple electrically conducting layers and an electrically conducting bottom layer which are separated by multiple electrically isolating layers, the multiple electrically isolating layers being laminated together with the electrically conducting layers and the electrically conducting bottom layer, which is provided at a bottom side of the multi-layer circuit board;
• wherein the multi-layer circuit board has at least one cavity, which is opened to a top side of the multi-layer circuit board, which the at least one cavity reaches through the multiple electrically conducting layers and the multiple electrically isolating layers and the at least one cavity reaches through the multi-layer circuit board to the electrically conducting bottom layer;
• wherein the at least one power semiconductor device is electrically connected to a top side of the multi-layer circuit board with a conducting member bonded to the top contact area and bonded to the top side of the multi-layer circuit board;
• wherein the power semiconductor device is bonded with a bottom contact area to the electrically conducting bottom layer;
• wherein the electrically conducting bottom layer is part of an insulated metal substrate that forms an integral part of the multi-layer circuit board, the insulated metal substrate comprising the electrically conducting bottom layer and a further metal layer isolated from the electrically conducting bottom layer by a further isolation layer different from the multiple electrically isolating layers.