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US 10,028,400 B2Granted
Semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorShin Soyano
Life of this patent
Estimating the term…
Abstract
In a semiconductor device, a multilayer substrate includes an insulating substrate, a first circuit board having a first semiconductor chip disposed thereon, and a second circuit board having a second semiconductor chip disposed thereon. On the multilayer substrate of the semiconductor device, a plate portion of a resin plate including a first positioning portion that regulates the position of each semiconductor chip is sandwiched between a first jumper terminal, which includes a first terminal connected to the first semiconductor chip and a first plate member perpendicular to the first terminal, and a second jumper terminal, which includes a second terminal connected to the second semiconductor chip and a second plate member perpendicular to the second terminal.
Claims15
A semiconductor device comprising:
- a multilayer substrate including an insulating substrate, a first circuit board disposed on a front surface of the insulating substrate, and a second circuit board disposed on the front surface in parallel with the first circuit board;
- a first semiconductor chip disposed on the first circuit board;
- a second semiconductor chip disposed on the second circuit board;
- a first jumper terminal including
- a first terminal portion electrically connected to a main electrode of the first semiconductor chip, and
- a first plate member;
- a second jumper terminal including
- a second terminal portion electrically connected to a main electrode of the second semiconductor chip, and
- a second plate member;
- and
- a resin plate including
- a first positioning portion placed on a front surface of the first circuit board and regulating a position of the first semiconductor chip with respect to the first circuit board,
- a second positioning portion placed on a front surface of the second circuit board and regulating a position of the second semiconductor chip with respect to the second circuit board, and
- a plate portion that is sandwiched between the first plate member and the second plate member at a position between the first circuit board and the second circuit board, wherein
- the first positioning portion is formed as a first protruding stepped part when viewed from above, and the first protruding stepped part regulates the position of the first semiconductor chip at two edges of the first protruding stepped part, and
- the second positioning portion is formed as a second protruding stepped part when viewed from above, and the second protruding stepped part regulates the position of the second semiconductor chip at two edges of the second protruding stepped part.
13 more elements
A semiconductor device comprising:
- a multilayer substrate including an insulating substrate, a first circuit board disposed on a front surface of the insulating substrate, and a second circuit board disposed on the front surface in parallel with the first circuit board;
- a first semiconductor chip disposed on the first circuit board;
- a second semiconductor chip disposed on the second circuit board;
- a first jumper terminal including
- a first terminal portion electrically connected to a main electrode of the first semiconductor chip, and
- a first plate member;
- a second jumper terminal including
- a second terminal portion electrically connected to a main electrode of the second semiconductor chip, and
- a second plate member;
- and
- a resin plate including
- a first positioning portion placed on a front surface of the first circuit board and regulating a position of the first semiconductor chip with respect to the first circuit board,
- a second positioning portion placed on a front surface of the second circuit board and regulating a position of the second semiconductor chip with respect to the second circuit board, and
- a plate portion that is sandwiched between the first plate member and the second plate member at a position between the first circuit board and the second circuit board,
- wherein the resin plate includes
- a first insertion portion into which the first plate member is inserted, and
- a second insertion portion into which the second plate member is inserted.
14 more elements
A semiconductor device comprising:
- a multilayer substrate including an insulating substrate, a first circuit board disposed on a front surface of the insulating substrate, and a second circuit board disposed on the front surface in parallel with the first circuit board;
- a first semiconductor chip disposed on the first circuit board;
- a second semiconductor chip disposed on the second circuit board;
- a first jumper terminal including
- a first terminal portion electrically connected to a main electrode of the first semiconductor chip, and
- a first plate member electrically connected to the first terminal portion;
- a second jumper terminal including
- a second terminal portion electrically connected to a main electrode of the second semiconductor chip, and
- a second plate member electrically connected to the second terminal portion;
- and
- a resin plate including
- a first positioning portion placed on a front surface of the first circuit board and regulating a position of the first semiconductor chip with respect to the first circuit board,
- a second positioning portion placed on a front surface of the second circuit board and regulating a position of the second semiconductor chip with respect to the second circuit board, and
- a plate portion that is sandwiched between the first plate member and the second plate member at a position between the first circuit board and the second circuit board,
- wherein a first surface of the first plate member of the first jumper terminal is mounted to the plate portion of the resin plate, and
- a length of the first positioning portion in a first direction perpendicular to the first surface is greater than a width of the first plate member in the first direction.
13 more elements
Dependencies are inferred from the claim text.