Semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorsTakahiro KOYAMA, Kensuke MATSUZAWA, Taisuke FUKUDA, Daisuke INOUE
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Abstract
A semiconductor device includes: a conductive substrate; a plurality of semiconductor chips provided on the conductive substrate; a printed wiring board including a first conductive layer provided on the conductive substrate, an insulating layer provided on the first conductive layer, and a second conductive layer provided on the insulating layer and electrically connected to respective first electrodes of the semiconductor chips; and a first external terminal provided on the second conductive layer to extend upward from the second conductive layer.
Claims7
A semiconductor device comprising:
- a conductive substrate;
- a plurality of semiconductor chips each having a first electrode and provided on the conductive substrate;
- a printed wiring board including a first conductive layer provided on the conductive substrate, an insulating layer provided on the first conductive layer, and a second conductive layer provided on the insulating layer and electrically connected to the respective first electrodes of the semiconductor chips;
- and
- a first external terminal provided on the second conductive layer to extend upward from the second conductive layer.
Dependencies are inferred from the claim text.