Flexible circuit leads in packaging for radio frequency devices
AssigneeNXP USA, Inc.
InventorsLakshminarayan Viswanathan, Michael E. Watts
Life of this patent
Estimating the term…
Abstract
A packaged RF device is provided that utilizes flexible circuit leads. The RF device includes at least one integrated circuit (IC) die configured to implement the RF device. The IC die is contained inside a package. In accordance with the embodiments described herein, a flexible circuit is implemented as a lead. Specifically, the flexible circuit lead is coupled to the at least one IC die inside the package and extends to outside the package, the flexible circuit lead thus providing an electrical connection to the at least one IC die inside the package.
Claims17
A radio-frequency (RF) device comprising:
- at least one integrated circuit (IC) die, the IC die including at least one RF amplifier to implement the RF device;
- a package containing the at least one IC die;
- and
- a flexible circuit lead coupled to the at least one IC die inside the package, the flexible circuit lead extending from inside the package to outside the package, the flexible circuit lead comprising at least one flexible base layer and at least one conductor, the flexible circuit lead providing an electrical connection to the at least one RF amplifier on the at least one IC die, wherein the at least one conductor is configured to form at least one passive device in a filter, with the filter electrically connected to the RF amplifier,
- wherein the filter further includes at least one at least one lumped passive element mounted on the flexible circuit lead.
A radio-frequency (RF) device comprising:
- an integrated circuit (IC) die, the IC die including at least one RF amplifier to implement the RF device;
- a package containing the IC die;
- and
- a flexible circuit lead coupled to the IC die inside the package, the flexible circuit lead extending from the inside the package to outside the package, the flexible circuit lead comprising at least one flexible base layer and at least one conductor, the flexible circuit lead providing an electrical connection to the at least one RF amplifier on the IC die wherein the at least one conductor is configured to form at least one passive device in a distributed impedance matching circuit in the flexible circuit lead, with the distributed impedance matching circuit electrically connected to the RF amplifier,
- wherein the distributed impedance matching circuit further includes at least one lumped passive element attached mounted on the flexible circuit lead.
A radio-frequency (RF) device comprising:
- an integrated circuit (IC) die, the IC die including at least one RF amplifier to implement the RF device;
- a package containing the IC die,
- a flexible circuit lead coupled to the IC die inside the package, the flexible circuit lead extending from inside the package to outside the package, the flexible circuit lead comprising at least one flexible base layer and at least one conductor, the flexible circuit lead providing an electrical connection to the at least one RF amplifier on the IC die:
- and
- a capacitor mounted on the flexible circuit lead and coupled to the at least one conductor, the capacitor configured to decouple the at least one RF amplifier,
- wherein the package further comprises an insulator inside the package, and wherein the flexible circuit lead is physically connected to the insulator inside the package and wherein the at least one conductor is electrically coupled to the at least one RF amplifier with at least one wirebond.
Dependencies are inferred from the claim text.