H10W 90/763
Between laterally-adjacent chips
Official title: {between laterally-adjacent chips}
H10W90/763 (Between laterally-adjacent chips) appears on 601 US grants and 782 published applications in this corpus.
Search patents in H10W- Granted patents
- 601
- Published applications
- 782
- Assignees
- 149
- Inventors
- 1,115
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 2 |
| 2002 | 2 | 1 |
| 2003 | 3 | 3 |
| 2004 | 2 | 12 |
| 2005 | 6 | 8 |
| 2006 | 9 | 8 |
| 2007 | 5 | 9 |
| 2008 | 3 | 11 |
| 2009 | 8 | 13 |
| 2010 | 6 | 12 |
| 2011 | 13 | 13 |
| 2012 | 12 | 24 |
| 2013 | 23 | 43 |
| 2014 | 24 | 49 |
| 2015 | 51 | 49 |
| 2016 | 53 | 50 |
| 2017 | 41 | 46 |
| 2018 | 45 | 45 |
| 2019 | 33 | 34 |
| 2020 | 35 | 39 |
| 2021 | 31 | 64 |
| 2022 | 43 | 50 |
| 2023 | 35 | 61 |
| 2024 | 39 | 61 |
| 2025 | 38 | 41 |
| 2026 | 32 | 34 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Package with low-warpage carrier6 Oct 2026US 12,757,756 B2Infineon Technologies AG
- Chip package with contact clip8 Sep 2026US 12,730,135 B2Infineon Technologies AG
- Semiconductor device8 Sep 2026US 12,733,496 B2Power Master Semiconductor Co., Ltd.
- Semiconductor device having a plurality of circuit patterns on a resin insulating layer25 Aug 2026US 12,721,164 B2Mitsubishi Electric Corporation
- Junction structure and semiconductor device25 Aug 2026US 12,721,189 B2Rohm Co., Ltd.
- Semiconductor device, semiconductor module, and vehicle8 Oct 2026US 2026/0314507 A1Rohm Co., Ltd.
- Power semiconductor package including stacked contact clips, system and method for fabricating a power semiconductor package10 Sep 2026US 2026/0271768 A1Infineon Technologies AG
- Semiconductor device3 Sep 2026US 2026/0262546 A1Rohm Co., Ltd.
- Monolithic spring assemblies for high-frequency press-pack modules20 Aug 2026US 2026/0248017 A1
- Power device13 Aug 2026US 2026/0240051 A1Delta Electronics, Inc.
Most cited
By later US patents
- Mold-type semiconductor device207US 5,218,231 AKabushiki Kaisha Toshiba · 1993
- Electronic component having at least two semiconductor power devices75US 7,271,470 B1Infineon Technologies AG · 2007
- Coolant cooled type semiconductor device70US 6,542,365 B2Denso Corporation · 2003
- Semiconductor device having radiation structure69US 6,703,707 B1Denso Corporation · 2004
- Power mosfet with integrated drivers in a common package60US 6,593,622 B2International Rectifier Corporation · 2003