Junction structure and semiconductor device

A junction structure, comprising:

• a conductive substrate including a conductive section;
• a terminal including an electro-conductive tubular holder, and a metal pin inserted into the holder;
• and
• a conductive bonding material bonding the conductive section and the holder to each other, wherein
• the metal pin includes a straight portion extending along a thickness direction of the conductive section,
• the holder includes a first through-hole extending in the thickness direction, and in which the straight portion of the metal pin is inserted,
• the conductive section includes a terminal bonding face to which the holder is bonded, and an opening formed in the terminal bonding face,
• at least a part of an outer peripheral edge of the opening is located on an inner side of an outer peripheral edge of the holder, as viewed in the thickness direction, and
• an outer peripheral edge of the conductive bonding material is located on an outer side of the outer peripheral edge of the holder, as viewed in the thickness direction.

A junction structure comprising:

• a conductive substrate including a conductive section;
• a terminal including an electro-conductive tubular holder, and a metal pin inserted into the holder;
• and
• a conductive bonding material bonding the conductive section and the holder to each other, wherein
• the metal pin includes a straight portion extending along a thickness direction of the conductive section,
• the holder includes a first through-hole extending in the thickness direction, and in which the straight portion of the metal pin is inserted,
• the conductive section includes a terminal bonding face to which the holder is bonded, and an opening formed in the terminal bonding face,
• at least a part of an outer peripheral edge of the opening is located on an inner side of an outer peripheral edge of the holder, as viewed in the thickness direction,
• the conductive section includes a second through-hole connected to the opening,
• the conductive bonding material is in contact with an inner surface of the second through-hole,
• the conductive substrate includes an insulation layer,
• the conductive section is stacked on one side of the insulation layer in the thickness direction,
• the insulation layer includes an exposed portion overlapping with the second through-hole as viewed in the thickness direction, and
• at least a part of the exposed portion is out of contact with the conductive bonding material.