Coolant cooled type semiconductor device
AssigneeDenso Corporation
InventorSeiji Inoue
Life of this patent
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Abstract
A coolant cooled type semiconductor device capable of achieving a superior heat radiation capability is provided, while having a simple structure. While a plurality of semiconductor modules are arranged in such a manner that main surface directions of these semiconductor modules are positioned in parallel to each other in a interval along a thickness direction thereof. These semiconductor modules are sandwiched by coolant tube having folded portions with fixing members. As a consequence, both surfaces of the semiconductor module can be cooled by a single coolant tube with a uniform pinching force.
Claims2
A cooled semiconductor apparatus, comprising:
- a pair of headers, which are parallel with each other and spaced apart;
- a plurality of pairs of coolant tube sections, wherein the coolant tube sections have end sections and central sections, and the end sections are joined to the headers, and at least one coolant tube section of each pair is connected to the header through connecting tube portions;
- and
- a plurality of semiconductor devices, wherein each semiconductor device is clamped between the coolant tube sections of one of the pairs, wherein the connecting tube portions are readily deformable and are deformed significantly more by a clamping force applied to the at least one tube section than the corresponding central section, wherein the apparatus includes a spring for applying the clamping force to the at least one tube section such that the at least one coolant tube section is urged toward the corresponding semiconductor device, wherein the spring is located between adjacent pairs of coolant tube sections such that the spring widens a space between the adjacent pairs.
A cooled semiconductor apparatus, comprising:
- a pair of headers, which are parallel with each other and spaced apart;
- a plurality of coolant tube sections arranged at predetermined intervals, wherein the coolant tube sections have end sections and central sections, and the end sections are joined to the headers;
- and
- a plurality of semiconductor devices, wherein each semiconductor device is clamped between a pair of the coolant tubes, wherein the end sections of at least one of the coolant tube sections forming each pair are readily deformable and are deformed significantly more by a clamping force applied to the at least one tube section than the corresponding central section, wherein the apparatus includes a spring for applying the clamping force to the at least one tube section such that the at least one coolant tube section is urged toward the corresponding semiconductor device, wherein the spring is located between one of the pairs of coolant tube sections and an adjacent pair of the coolant tube sections such that the spring widens a space between the pairs of coolant tube sections.
Dependencies are inferred from the claim text.