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US 7,271,470 B1Granted
Electronic component having at least two semiconductor power devices
AssigneeInfineon Technologies AG
InventorRalf Otremba
Life of this patent
Estimating the term…
Abstract
An electronic component includes at least two vertical semiconductor power devices and an electrically conductive contact clip. Each vertical semiconductor device has a first side with at least one first lead electrode and a second side opposing the first side with at least one second load electrode. The contact clip comprises a flat web portion and at least one peripheral rim portion extending from an edge region of the flat web portion. Each of the at least two vertical semiconductor power devices is attached, and electrically connected to, the lower surface of the flat web portion of the contact clip.
Claims25
An electronic component, comprising:
- at least two vertical semiconductor power devices, each vertical semiconductor device comprising a first side and a second side opposing the first side, wherein at least one first load electrode is positioned on the first side and at least one second load electrode is positioned on the second side,
- an electrically conductive contact clip, the contact clip comprising a flat web portion and at least one peripheral rim portion extending from an edge region of the flat web portion in a direction towards the lower side of the flat web portion,
- a plurality of surface mountable outer contact surfaces,
- a leadframe comprising a lower surface providing surface mountable outer contact surfaces and an upper surface and providing at least two die support portions,
- wherein each of the at least two vertical semiconductor power devices is positioned between the upper surface of the leadframe and the lower surface of the flat web portion of the contact clip and is attached to, and electrically connected to, the upper surface of the leadframe and to the lower surface of the flat web portion of the contact clip.
2 more elements
An electronic component comprising a base component and at least one stack component, wherein the base component comprises:
- at least two base vertical semiconductor power devices, each base vertical semiconductor device comprising a first side and a second side opposing the first side, wherein at least one first load electrode is positioned on the first side and at least one second load electrode is positioned on the second side,
- an electrically conductive base contact clip, the base contact clip comprising a base flat web portion and at least one base peripheral rim portion, wherein the base flat web portion has a lower side and an upper side, wherein a base peripheral rim portion extends from an edge region of the base flat web portion in a direction towards the lower side of the base flat web portion,
- a plurality of surface mountable outer contact surfaces,
- wherein each of the at least two base vertical semiconductor power devices is attached to, and electrically connected to, the lower surface of the base flat web portion of the base contact clip,
- and wherein the stack component comprises:
- at least two stack vertical semiconductor power devices, each stack vertical semiconductor device comprising a first side and a second side opposing the first side, wherein at least one first load electrode is positioned on the first side and at least one second load electrode is positioned on the second side,
- wherein each of the stack vertical semiconductor power devices is attached to, and electrically connected to, the upper surface of the base contact clip of the base component.
4 more elements
A method comprising:
- providing at least two base vertical semiconductor power devices, each base vertical semiconductor device comprising a first side and a second side opposing the first side, wherein at least one first load electrode is positioned on the first side and at least one second load electrode is positioned on the second side,
- providing an electrically conductive base contact clip, the base contact clip comprising a base flat web portion and at least one base peripheral rim portion, wherein the base flat web portion has a lower side and an upper side, wherein a base peripheral rim portion extends from an edge region of the base flat web portion in a direction towards the lower side of the base flat web portion,
- a plurality of surface mountable outer contact surfaces,
- attaching and electrically connecting each of the at least two base vertical semiconductor power devices to the lower surface of the base flat web portion of the base contact clip,
- providing at least two stack vertical semiconductor power devices, each stack vertical semiconductor device comprising a first side and a second side opposing the first side, wherein at least one first load electrode is positioned on the first side and at least one second load electrode is positioned on the second side,
- attaching and electrically connecting each of the stack vertical power devices to the upper surface of the base contact clip of the base component.
3 more elements
Dependencies are inferred from the claim text.