H10W 90/766
Between a chip and a stacked lead frame, conducting package substrate or
Official title: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
H10W90/766 (Between a chip and a stacked lead frame, conducting package substrate or) appears on 1,306 US grants and 1,636 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,306
- Published applications
- 1,636
- Assignees
- 234
- Inventors
- 1,889
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 4 | 4 |
| 2002 | 10 | 17 |
| 2003 | 16 | 10 |
| 2004 | 8 | 12 |
| 2005 | 11 | 23 |
| 2006 | 15 | 24 |
| 2007 | 16 | 48 |
| 2008 | 14 | 41 |
| 2009 | 24 | 60 |
| 2010 | 49 | 52 |
| 2011 | 47 | 60 |
| 2012 | 57 | 90 |
| 2013 | 80 | 68 |
| 2014 | 63 | 92 |
| 2015 | 98 | 102 |
| 2016 | 83 | 91 |
| 2017 | 99 | 90 |
| 2018 | 78 | 87 |
| 2019 | 84 | 94 |
| 2020 | 70 | 82 |
| 2021 | 80 | 99 |
| 2022 | 62 | 100 |
| 2023 | 71 | 80 |
| 2024 | 67 | 77 |
| 2025 | 57 | 71 |
| 2026 | 29 | 62 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Package with low-warpage carrier6 Oct 2026US 12,757,756 B2Infineon Technologies AG
- Current sensor with inverted shielding element15 Sep 2026US 12,740,436 B2Littelfuse Semiconductor (Wuxi) Co., Ltd.
- Apparatus for bonding clip, method of bonding clip, and semiconductor package including semiconductor chip to which clip is bonded using the method8 Sep 2026US 12,733,527 B2JMJ Korea Co., Ltd.
- Power semiconductor device25 Aug 2026US 12,721,245 B2Infineon Technologies Austria AG
- Pre-molded lead frames for semiconductor packages18 Aug 2026US 12,713,939 B2Infineon Technologies AG
- Power semiconductor package including a molded body with protrusion and method for fabricating the same1 Oct 2026US 2026/0305381 A1
- Semiconductor device and method for manufacturing semiconductor device24 Sep 2026US 2026/0293702 A1Kabushiki Kaisha Toshiba
- Method of manufacturing a plurality of semiconductor devices as well as a corresponding semiconductor device24 Sep 2026US 2026/0293703 A1Nexperia B. V.
- Semiconductor device and manufacturing method for semiconductor device17 Sep 2026US 2026/0283004 A1Rohm Co., Ltd.
- Method of manufacturing semiconductor devices and corresponding semiconductor device3 Sep 2026US 2026/0262526 A1STMicroelectronics International N. V.
Most cited
By later US patents
- Semiconductor device including cladded base plate274US 8,963,321 B2Infineon Technologies AG · 2015
- Self-centering electrode for power devices249US 4,935,803 AMotorola, Inc. · 1990
- Semiconductor package243US 6,040,626 AInternational Rectifier Corporation · 2000
- Symmetrical package for semiconductor die208US 6,256,200 B12001
- Mold-type semiconductor device207US 5,218,231 AKabushiki Kaisha Toshiba · 1993