Semiconductor device and manufacturing method for semiconductor device

A semiconductor device comprising:

• a first lead;
• a second lead located next to the first lead in a direction orthogonal to a thickness direction of the first lead;
• a first semiconductor element mounted on the first lead and electrically connected to the second lead;
• and
• a sealing resin covering a part of each of the first lead and the second lead, and covering the first semiconductor element,
• wherein the sealing resin includes a bottom surface facing in the thickness direction and an outer side surface connected to the bottom surface and facing outward from the sealing resin in the direction orthogonal to the thickness direction,
• the sealing resin is formed with a recess that is recessed from the bottom surface,
• the recess includes an inner side surface connected to the bottom surface and facing inward in the sealing resin in the direction orthogonal to the thickness direction,
• the second lead includes a reverse surface exposed at the bottom surface and a side surface connected to the reverse surface and exposed at the outer side surface,
• the recess is located between the first lead and the second lead, and
• the second lead and the first lead include inner end surfaces exposed at the inner side surface.