H10W 80/033
By chemical means
Official title: {by chemical means, e.g. etching}
H10W80/033 (By chemical means) appears on 81 US grants and 113 published applications in this corpus.
Search patents in H10W- Granted patents
- 81
- Published applications
- 113
- Assignees
- 28
- Inventors
- 169
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 1 | 1 |
| 2014 | 1 | 1 |
| 2015 | 0 | 2 |
| 2016 | 0 | 0 |
| 2017 | 1 | 1 |
| 2018 | 1 | 4 |
| 2019 | 3 | 7 |
| 2020 | 7 | 14 |
| 2021 | 10 | 17 |
| 2022 | 11 | 14 |
| 2023 | 10 | 14 |
| 2024 | 10 | 15 |
| 2025 | 19 | 16 |
| 2026 | 6 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Nano-roughened interconnects for integrated circuit packages29 Sep 2026US 12,751,312 B2Intel Corporation
- Selective alteration of interconnect pads for direct bonding29 Sep 2026US 12,751,313 B2Adeia Semiconductor Bonding Technologies Inc.
- Substrate trench for improved hybrid bonding4 Aug 2026US 12,702,044 B2Intel Corporation
- Direct bonding methods and structures14 Apr 2026US 12,604,771 B2Adeia Semiconductor Bonding Technologies Inc.
- Direct bonding methods and structures10 Feb 2026US 12,550,799 B2Adeia Semiconductor Bonding Technologies Inc.
- Method for manufacturing semiconductor device1 Oct 2026US 2026/0305461 A1Resonac Corporation
- Direct bonding methods and structures9 Jul 2026US 2026/0198394 A1Adeia Semiconductor Bonding Technologies Inc.
- Dbi to si bonding for simplified handle wafer2 Jul 2026US 2026/0190893 A1Adeia Semiconductor Bonding Technologies Inc.
- Die processing28 May 2026US 2026/0150611 A1Adeia Semiconductor Bonding Technologies Inc.
- Manufacturing method of semiconductor device14 May 2026US 2026/0137009 A1SK hynix Inc.
Most cited
By later US patents
- Semiconductor device and associated fabrication method309US 5,753,536 AMatsushita Electric Industrial Co., Ltd. · 1998
- Conductive barrier direct hybrid bonding254US 9,953,941 B2Invensas Bonding Technologies, Inc. · 2018
- Die processing235US 10,269,756 B2Invensas Bonding Technologies, Inc. · 2019
- DBI to Si bonding for simplified handle wafer174US 10,964,664 B2Invensas Bonding Technologies, Inc. · 2021
- Bonding surfaces for microelectronics171US 11,056,348 B2Invensas Bonding Technologies, Inc. · 2021