Direct bonding methods and structures
AssigneeAdeia Semiconductor Bonding Technologies Inc.
InventorsCyprian Emeka Uzoh, Jeremy Alfred Theil, Gaius Gillman Fountain, Jr., Dominik Suwito
Life of this patent
Estimating the term…
Abstract
Disclosed herein are methods for direct bonding. In some embodiments, the direct bonding method includes providing a first element having a first bonding surface, providing a second element having a second bonding surface, slightly etching the first bonding surface, treating the first bonding surface with a terminating liquid treatment to terminate the first bonding surface with a terminating species, and directly bonding the first bonding surface to the second bonding surface without the use of an intervening adhesive and without exposing the first bonding surface to plasma.
Claims22
A bonding method comprising:
- providing a first element having a first bonding surface and a protective layer on the first bonding surface, the first bonding surface comprising a first nonconductive field region and a first plurality of contact features;
- providing a second element having a second bonding surface, the second bonding surface comprising a second nonconductive field region and a second plurality of contact features;
- removing the protective layer from the first element without exposing the first element to a plasma;
- etching the first bonding surface of the first element with a liquid etchant to activate the first bonding surface;
- after the etching, treating the first bonding surface with a terminating liquid treatment to terminate the first bonding surface with a terminating species;
- and
- after the treating, directly bonding the first bonding surface to the second bonding surface such that the first and second nonconductive field regions are directly bonded to one another without an intervening adhesive and such that the first and second pluralities of contact features are directly bonded to one another without an intervening adhesive.
A bonding method comprising:
- providing a first element having a first bonding surface, the first bonding surface comprising a first nonconductive field region and a first plurality of contact features;
- providing a second element having a second bonding surface, the second bonding surface comprising a second nonconductive field region and a second plurality of contact features;
- treating the first bonding surface with a terminating liquid treatment that comprises a glass-forming solution to terminate the first bonding surface with a terminating species, wherein the glass-forming solution comprises one or more glass forming elements selected from the group that includes phosphorus, arsenic, boron, carbon, and manganese;
- and
- after the treating, directly bonding the first bonding surface to the second bonding surface such that the first and second nonconductive field regions are directly bonded to one another without an intervening adhesive and such that the first and second pluralities of contact features are directly bonded to one another without an intervening adhesive,
- wherein the first bonding surface of the first element is not exposed to a plasma before the direct bonding.
A bonding method comprising:
- polishing a first bonding surface of a first element, the first bonding surface comprising a first nonconductive field region and a first plurality of contact features;
- after the polishing, providing a protective layer on the first bonding surface;
- singulating the first element into a plurality of dies, wherein the plurality of dies comprises a first die that comprises a portion of the first bonding surface and a portion of the protective layer on the portion of the first bonding surface;
- removing the portion of the protective layer to expose the portion of the first bonding surface and cleaning the portion of the first bonding surface of the first die without exposing the first bonding surface to a plasma;
- and
- after the cleaning, treating the portion of the first bonding surface with a terminating liquid treatment to terminate the portion of the first bonding surface with a terminating species.
Dependencies are inferred from the claim text.