H10W 80/031
Changing or setting shapes of the pads
Official title: {Changing or setting shapes of the pads}
H10W80/031 (Changing or setting shapes of the pads) appears on 234 US grants and 309 published applications in this corpus.
Search patents in H10W- Granted patents
- 234
- Published applications
- 309
- Assignees
- 65
- Inventors
- 428
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 1 |
| 2005 | 1 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 2 |
| 2009 | 1 | 0 |
| 2010 | 2 | 2 |
| 2011 | 0 | 1 |
| 2012 | 2 | 2 |
| 2013 | 2 | 6 |
| 2014 | 8 | 7 |
| 2015 | 4 | 8 |
| 2016 | 5 | 7 |
| 2017 | 7 | 7 |
| 2018 | 10 | 17 |
| 2019 | 9 | 16 |
| 2020 | 19 | 24 |
| 2021 | 24 | 47 |
| 2022 | 32 | 50 |
| 2023 | 34 | 31 |
| 2024 | 27 | 32 |
| 2025 | 36 | 35 |
| 2026 | 10 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Nano-roughened interconnects for integrated circuit packages29 Sep 2026US 12,751,312 B2Intel Corporation
- Selective alteration of interconnect pads for direct bonding29 Sep 2026US 12,751,313 B2Adeia Semiconductor Bonding Technologies Inc.
- Member for solid-state image pickup device and method for manufacturing solid-state image pickup device11 Aug 2026US 12,707,732 B2Canon Kabushiki Kaisha
- Microelectronic assemblies with inductors in direct bonding regions4 Aug 2026US 12,701,724 B2Intel Corporation
- Substrate trench for improved hybrid bonding4 Aug 2026US 12,702,044 B2Intel Corporation
- Method for manufacturing semiconductor device, and semiconductor device1 Oct 2026US 2026/0304908 A1Resonac Corporation
- Method for manufacturing semiconductor device1 Oct 2026US 2026/0305461 A1Resonac Corporation
- Direct bonding methods and structures9 Jul 2026US 2026/0198394 A1Adeia Semiconductor Bonding Technologies Inc.
- Dbi to si bonding for simplified handle wafer2 Jul 2026US 2026/0190893 A1Adeia Semiconductor Bonding Technologies Inc.
- Direct bonding methods and structures25 Jun 2026US 2026/0182476 A1Adeia Semiconductor Bonding Technologies Inc.
Most cited
By later US patents
- Semiconductor device and associated fabrication method309US 5,753,536 AMatsushita Electric Industrial Co., Ltd. · 1998
- Methods for hybrid wafer bonding271US 8,802,538 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Three dimensional integrated circuit structures and hybrid bonding methods for semiconductor wafers256US 8,809,123 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Conductive barrier direct hybrid bonding254US 9,953,941 B2Invensas Bonding Technologies, Inc. · 2018
- Method for bonding wafers to produce stacked integrated circuits253US 8,183,127 B2Tezzaron Semiconductor, Inc. · 2012