Member for solid-state image pickup device and method for manufacturing solid-state image pickup device

A method for manufacturing a device, comprising:

• providing a first member which includes a first substrate having a first face and a second face, and a first structure on the first face of the first substrate;
• providing a second member which includes a second substrate having a first face and a second face, and a second structure on the first face of the second substrate;
• and
• bonding the first member and the second member so that the first structure and the second structure are disposed between the first face of the first substrate and the first face of the second substrate,
• wherein the first structure includes a first insulating film having a groove, includes a first conductive portion in the groove of the first insulating film and includes a first film of barrier metal between the first conductive portion and the first insulating film,
• wherein the second structure includes a second insulating film having a groove, includes a second conductive portion in the groove of the second insulating film and includes a second film of barrier metal between the second conductive portion and the second insulating film,
• wherein before the bonding, a height of an upper face of the first insulating film from the first face of the first substrate is lower than a height of an upper face of the first conductive portion from the first face of the first substrate,
• wherein, before the bonding, a height of an upper face of the second conductive portion from the first face of the second substrate is lower than a height of an upper face of the second insulating film from the first face of the second substrate, and
• wherein in the bonding, the upper face of the first insulating film and the upper face of the second insulating film are bonded together, and at least a first part of the first conductive portion and at least a second part of the second conductive portion are bonded together.