H10W 80/035
By heating
Official title: {by heating, e.g. melting or causing diffusion}
H10W80/035 (By heating) appears on 67 US grants and 76 published applications in this corpus.
Search patents in H10W- Granted patents
- 67
- Published applications
- 76
- Assignees
- 23
- Inventors
- 68
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2004 | 0 | 1 |
| 2005 | 1 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 2 |
| 2009 | 1 | 0 |
| 2010 | 2 | 1 |
| 2011 | 0 | 1 |
| 2012 | 2 | 1 |
| 2013 | 1 | 5 |
| 2014 | 7 | 4 |
| 2015 | 3 | 5 |
| 2016 | 3 | 6 |
| 2017 | 6 | 6 |
| 2018 | 7 | 8 |
| 2019 | 5 | 9 |
| 2020 | 5 | 3 |
| 2021 | 6 | 6 |
| 2022 | 2 | 1 |
| 2023 | 7 | 4 |
| 2024 | 1 | 6 |
| 2025 | 5 | 2 |
| 2026 | 3 | 3 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Member for solid-state image pickup device and method for manufacturing solid-state image pickup device11 Aug 2026US 12,707,732 B2Canon Kabushiki Kaisha
- Systems and methods for bonding semiconductor devices28 Jul 2026US 12,696,826 B2Tokyo Electron Limited
- Manufacturing method of semiconductor device3 Feb 2026US 12,543,602 B2SK hynix Inc.
- DBI to Si bonding for simplified handle wafer7 Oct 2025US 12,438,122 B2Adeia Semiconductor Bonding Technologies Inc.
- Conductive barrier direct hybrid bonding5 Aug 2025US 12,381,168 B2Adeia Semiconductor Bonding Technologies Inc.
- Dbi to si bonding for simplified handle wafer2 Jul 2026US 2026/0190893 A1Adeia Semiconductor Bonding Technologies Inc.
- Manufacturing method of semiconductor device14 May 2026US 2026/0137009 A1SK hynix Inc.
- Conductive barrier direct hybrid bonding5 Mar 2026US 2026/0068734 A1Adeia Semiconductor Bonding Technologies Inc.
- Wafer and die shape control11 Dec 2025US 2025/0379057 A1Carl Zeiss SMS GmbH
- Member for solid-state image pickup device and method for manufacturing solid-state image pickup device20 Feb 2025US 2025/0063832 A1Canon Kabushiki Kaisha
Most cited
By later US patents
- Methods for hybrid wafer bonding271US 8,802,538 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Three dimensional integrated circuit structures and hybrid bonding methods for semiconductor wafers256US 8,809,123 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Conductive barrier direct hybrid bonding254US 9,953,941 B2Invensas Bonding Technologies, Inc. · 2018
- Method for bonding wafers to produce stacked integrated circuits253US 8,183,127 B2Tezzaron Semiconductor, Inc. · 2012
- Conductive pad structure for hybrid bonding and methods of forming same243US 9,437,572 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016