H10W 80/037
By mechanical treatment
Official title: {by mechanical treatment, e.g. by cutting, pressing or stamping}
H10W80/037 (By mechanical treatment) appears on 80 US grants and 112 published applications in this corpus.
Search patents in H10W- Granted patents
- 80
- Published applications
- 112
- Assignees
- 30
- Inventors
- 163
- Latest grant
- 2 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2010 | 0 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 1 | 1 |
| 2014 | 1 | 2 |
| 2015 | 1 | 1 |
| 2016 | 1 | 1 |
| 2017 | 0 | 2 |
| 2018 | 4 | 7 |
| 2019 | 3 | 6 |
| 2020 | 7 | 10 |
| 2021 | 7 | 17 |
| 2022 | 14 | 19 |
| 2023 | 13 | 10 |
| 2024 | 14 | 16 |
| 2025 | 13 | 13 |
| 2026 | 1 | 5 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device and manufacturing method thereof2 Jun 2026US 12,648,459 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Bonding tool and bonding method thereof7 Oct 2025US 12,438,118 B2Taiwan Semiconductor Manufacturing Company.Ltd
- DBI to Si bonding for simplified handle wafer7 Oct 2025US 12,438,122 B2Adeia Semiconductor Bonding Technologies Inc.
- Direct bonding methods and structures23 Sep 2025US 12,424,584 B2Adeia Semiconductor Bonding Technologies Inc.
- Apparatus and method for bonding substrates9 Sep 2025US 12,412,865 B2EV Group E. Thallner GmbH
- Method for manufacturing semiconductor device, and semiconductor device1 Oct 2026US 2026/0304908 A1Resonac Corporation
- Method for manufacturing semiconductor device1 Oct 2026US 2026/0305461 A1Resonac Corporation
- Dbi to si bonding for simplified handle wafer2 Jul 2026US 2026/0190893 A1Adeia Semiconductor Bonding Technologies Inc.
- Direct bonding methods and structures25 Jun 2026US 2026/0182476 A1Adeia Semiconductor Bonding Technologies Inc.
- Conductive barrier direct hybrid bonding5 Mar 2026US 2026/0068734 A1Adeia Semiconductor Bonding Technologies Inc.
Most cited
By later US patents
- Conductive barrier direct hybrid bonding254US 9,953,941 B2Invensas Bonding Technologies, Inc. · 2018
- Bonded structures181US 10,002,844 B1Invensas Bonding Technologies, Inc. · 2018
- DBI to Si bonding for simplified handle wafer174US 10,964,664 B2Invensas Bonding Technologies, Inc. · 2021
- Bonding surfaces for microelectronics171US 11,056,348 B2Invensas Bonding Technologies, Inc. · 2021
- Bonded structures133US 11,004,757 B2Invensas Bonding Technologies, Inc. · 2021