US 12,424,584 B2 · Direct bonding methods and structures

Abstract

A bonding method can include polishing a first bonding layer of a first element for direct bonding, the first bonding layer comprises a first conductive pad and a first non-conductive bonding region. After the polishing, a last chemical treatment can be performed on the polished first bonding layer. After performing the last chemical treatment, the first bonding layer of the first element can be directly bonded to a second bonding layer of a second element without an intervening adhesive, including directly bonding the first conductive pad to a second conductive pad of the second bonding layer and directly bonding the first non-conductive bonding region to a second nonconductive bonding region of the second bonding layer. No treatment or rinse is performed on the first bonding layer between performing the last chemical treatment and directly bonding.

Claims33

Dependent claims

A bonding method comprising:

polishing a first bonding layer of a first element for direct bonding, the first bonding layer comprises a first conductive pad and a first non-conductive bonding region;
after the polishing, performing a last chemical treatment of the polished first bonding layer;
and
after performing the last chemical treatment, directly bonding the first bonding layer of the first element to a second bonding layer of a second element without an intervening adhesive, including directly bonding the first conductive pad to a second conductive pad of the second bonding layer and directly bonding the first non-conductive bonding region to a second nonconductive bonding region of the second bonding layer, wherein no treatment or rinse is performed on the first bonding layer between performing the last chemical treatment and directly bonding.

1 more element

Dependencies are inferred from the claim text.

Direct bonding methods and structures

Life of this patent

Direct bonding methods and structures

Life of this patent

Abstract

Claims33