Bonding tool and bonding method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Yuan Chiu, Shih-Yen Chen, Chi-Chun Peng, Hong-Kun Chen, Hui-Ting Lin
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Abstract
A bonding tool and a bonding method are provided. The method includes attaching a semiconductor die to a bonding tool having a first surface, wherein the bonding tool comprises a bending member movably arranged in a trench of the bonding tool, and the bending member protrudes from the first surface and bends the semiconductor die; moving the semiconductor die toward a semiconductor wafer to cause a retraction of the bending member and a partial bonding at a portion of the semiconductor die and the semiconductor wafer; and causing a full bonding between the semiconductor die and the semiconductor wafer subsequent to the partial bonding.
Claims20
A method, comprising:
- attaching a semiconductor die to a bonding tool having a first surface, wherein the bonding tool comprises a plurality of vacuum holes and a bending member movably arranged in a trench of the bonding tool, wherein the plurality of vacuum holes provide a vacuum force to hold the semiconductor die, and the bending member protrudes from the first surface and bends the semiconductor die;
- causing a partial bonding at a portion of the semiconductor die and a semiconductor wafer, the portion overlapping the bending member from a top-view perspective;
- causing a full bonding between the semiconductor die and the semiconductor wafer subsequent to the partial bonding while keeping the vacuum force to hold the semiconductor die at the same time;
- and
- releasing the semiconductor die from the bonding tool by removing the vacuum force subsequent to the full bonding.
A method, comprising:
- receiving a bonding tool having a first surface and a bending member protruding from the first surface;
- attaching a semiconductor die to the bonding tool and applying a vacuum force to hold a periphery region of the semiconductor die, wherein the semiconductor die is deformed by a protrusion of the bending member and the vacuum force of the bonding tool;
- contacting the semiconductor die with a semiconductor wafer, the contacting of the semiconductor die with the semiconductor wafer causing the bending member to retract toward the first surface;
- causing a full bonding between the semiconductor die and the semiconductor wafer while keeping the vacuum force to hold the semiconductor die at the same time;
- and
- releasing the semiconductor die from the bonding tool by removing the vacuum force subsequent to the full bonding.
A method, comprising:
- receiving a bonding tool comprising a bending member and a wafer chuck, wherein the wafer chuck comprises a trench and a vacuum hole, and the bending member is movably arranged in the trench and protrudes from a first surface of the bonding tool;
- attaching a semiconductor die to the bonding tool by exerting a vacuum force through the vacuum hole, wherein the semiconductor die is deformed by a protrusion of the bending member and the vacuum force from the bonding tool;
- contacting the semiconductor die to a semiconductor wafer to push the bending member into a retracted position;
- causing a full bonding between the semiconductor die and the semiconductor wafer while keeping the vacuum force to hold the semiconductor die at the same time;
- and
- releasing the semiconductor die from the bonding tool by removing the vacuum force subsequent to the full bonding.
Dependencies are inferred from the claim text.