Apparatus and method for bonding substrates
AssigneeEV Group E. Thallner GmbH
InventorsDominik Zinner, Thomas Wagenleitner, Jurgen Markus Suss, Thomas Plach, Jurgen Mallinger
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Abstract
A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates includes a device in which the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck. A plate is arranged between the second substrate and the second chuck. The second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding.
Claims16
A device for bonding a first substrate to a second substrate at mutually facing contact surfaces of the first and second substrates, said device comprising:
- a first chuck configured to mount the first substrate;
- a second chuck configured to mount the second substrate;
- a first plate arranged between the second substrate and the second chuck;
- and
- bend-changing means configured to deform the first plate with the second substrate with respect to the second chuck,
- wherein the deformation is controlled during bonding of the first substrate to the second substrate,
- wherein the second chuck has first limiting elements configured to mechanically fix the first plate in a circumferential region on the first plate, and
- wherein a thickness of the first plate is in a range between 0.1 mm and 10 mm.
Dependencies are inferred from the claim text.