Bonded structures
AssigneeInvensas Bonding Technologies, Inc.
InventorsRajesh Katkar, Laura Wills Mirkarimi, Bongsub Lee, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh
Life of this patent
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Abstract
A bonded structure is disclosed. The bonded structure includes a first element and a second element that is bonded to the first element along a bonding interface. The bonding interface has an elongate conductive interface feature and a nonconductive interface feature. The bonded structure also includes an integrated device that is coupled to or formed with the first element or the second element. The elongate conductive interface feature has a recess through a portion of a thickness of the elongate conductive interface feature. A portion of the nonconductive interface feature is disposed in the recess.
Claims20
A bonded structure comprising:
- a first element comprising a first conductive feature and a first nonconductive feature, the first conductive feature having a front side and a back side opposite the front side;
- a second element comprising a second conductive feature having a front side and a back side opposite the front side, and a second nonconductive feature, the front side of the second conductive feature bonded to the front side of the first conductive feature along a bonding interface to at least partially form an elongate conductive interface feature, and the second nonconductive feature bonded to the first nonconductive feature along the bonding interface to at least partially form a nonconductive interface feature;
- and
- an integrated device coupled to or formed with the first element or the second element,
- wherein the elongate conductive interface feature comprises a recess partially through a thickness of the first conductive feature between the front side and the back side of the first conductive feature, and wherein a portion of the nonconductive interface feature is disposed in the recess.
A bonded structure comprising:
- a first element comprising a first conductive feature and a first nonconductive feature, the first conductive feature having a front side and a back side opposite the front side;
- a second element comprising a second conductive feature having a front side and a back side opposite the front side, and a second nonconductive feature, the front side of the second conductive feature directly bonded to the front side of the first conductive feature without an adhesive along a bonding interface to at least partially form an elongate conducive interface feature, the second nonconductive feature directly bonded to the first nonconductive feature without an adhesive along the bonding interface to form a nonconductive interface feature;
- and
- an integrated device coupled to or formed with the first element or the second element,
- wherein the elongate conductive interface feature comprises a recess partially through a thickness of the first conductive feature between the front side and the back side of the first conductive feature, and wherein a portion of the nonconductive interface feature is disposed in the recess, and
- wherein the elongate conductive interface feature is disposed around the integrated device so as to define an effectively closed profile around the integrated device to seal the integrated device from the outside environs.
Dependencies are inferred from the claim text.