H10W 70/687
Characterized by the outer layers being for protection
Official title: {characterized by the outer layers being for protection, e.g. solder masks, or for protection against chemical or mechanical damage}
H10W70/687 (Characterized by the outer layers being for protection) appears on 472 US grants and 642 published applications in this corpus.
Search patents in H10W- Granted patents
- 472
- Published applications
- 642
- Assignees
- 126
- Inventors
- 1,078
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 0 | 1 |
| 2003 | 3 | 3 |
| 2004 | 0 | 1 |
| 2005 | 3 | 3 |
| 2006 | 1 | 1 |
| 2007 | 2 | 4 |
| 2008 | 1 | 19 |
| 2009 | 5 | 61 |
| 2010 | 15 | 45 |
| 2011 | 16 | 50 |
| 2012 | 44 | 47 |
| 2013 | 53 | 45 |
| 2014 | 44 | 51 |
| 2015 | 46 | 38 |
| 2016 | 32 | 27 |
| 2017 | 26 | 24 |
| 2018 | 24 | 35 |
| 2019 | 26 | 20 |
| 2020 | 21 | 25 |
| 2021 | 25 | 14 |
| 2022 | 15 | 36 |
| 2023 | 21 | 39 |
| 2024 | 14 | 28 |
| 2025 | 25 | 10 |
| 2026 | 10 | 15 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Substrate structure, module, method for manufacturing the substrate structure, and method for manufacturing the module11 Aug 2026US 12,708,055 B2Murata Manufacturing Co., Ltd.
- Semiconductor package4 Aug 2026US 12,702,026 B2LG Innotek Co., Ltd.
- Integrated circuit structure and manufacturing method thereof28 Jul 2026US 12,696,794 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and manufacturing method thereof28 Apr 2026US 12,616,053 B2Amkor Technology Singapore Holding Pte.Ltd.
- Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same21 Apr 2026US 12,610,839 B2Micron Technology, Inc.
- Integrated circuit structure and manufacturing method thereof8 Oct 2026US 2026/0314480 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package24 Sep 2026US 2026/0293700 A1LG Innotek Co., Ltd.
- Semiconductor package and electronic system including the same17 Sep 2026US 2026/0282984 A1Samsung Electronics Co., Ltd.
- Package substrate with a plating layer and a semiconductor package including the same6 Aug 2026US 2026/0231797 A1SK hynix Inc.
- Circuit board, and semiconductor package comprising same6 Aug 2026US 2026/0231800 A1LG Innotek Co., Ltd.
Most cited
By later US patents
- Chip-on-Wafer structures and methods for forming the same304US 8,643,148 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices269US 7,749,882 B2Micron Technology, Inc. · 2010
- Flip chip bump structure and fabrication method172US 7,932,170 B1Amkor Technology, Inc. · 2011
- Substrate for semiconductor device and manufacturing method thereof149US 7,902,660 B1Amkor Technology, Inc. · 2011
- Stackable molded microelectronic packages119US 8,482,111 B2Tessera, Inc. · 2013