H10W 70/67
Characterised by their insulating layers or insulating parts
Official title: characterised by their insulating layers or insulating parts
H10W70/67 (Characterised by their insulating layers or insulating parts) appears on 24,599 US grants and 28,549 published applications in this corpus.
Search patents in H10W- Granted patents
- 24,599
- Published applications
- 28,549
- Assignees
- 2,968
- Inventors
- 30,943
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 17 | 0 |
| 1977 | 15 | 0 |
| 1978 | 11 | 0 |
| 1979 | 17 | 0 |
| 1980 | 16 | 0 |
| 1981 | 31 | 0 |
| 1982 | 32 | 0 |
| 1983 | 36 | 0 |
| 1984 | 38 | 0 |
| 1985 | 64 | 0 |
| 1986 | 53 | 0 |
| 1987 | 93 | 0 |
| 1988 | 93 | 0 |
| 1989 | 102 | 0 |
| 1990 | 107 | 0 |
| 1991 | 148 | 0 |
| 1992 | 165 | 0 |
| 1993 | 141 | 0 |
| 1994 | 184 | 0 |
| 1995 | 170 | 0 |
| 1996 | 203 | 0 |
| 1997 | 234 | 0 |
| 1998 | 325 | 0 |
| 1999 | 333 | 0 |
| 2000 | 363 | 0 |
| 2001 | 444 | 221 |
| 2002 | 520 | 579 |
| 2003 | 476 | 524 |
| 2004 | 493 | 648 |
| 2005 | 445 | 716 |
| 2006 | 459 | 689 |
| 2007 | 497 | 698 |
| 2008 | 417 | 743 |
| 2009 | 421 | 651 |
| 2010 | 529 | 664 |
| 2011 | 540 | 668 |
| 2012 | 589 | 745 |
| 2013 | 654 | 771 |
| 2014 | 729 | 955 |
| 2015 | 847 | 1058 |
| 2016 | 987 | 1100 |
| 2017 | 1053 | 1171 |
| 2018 | 1086 | 1298 |
| 2019 | 1241 | 1539 |
| 2020 | 1300 | 1837 |
| 2021 | 1334 | 1756 |
| 2022 | 1361 | 1915 |
| 2023 | 1381 | 1953 |
| 2024 | 1390 | 2264 |
| 2025 | 1426 | 2066 |
| 2026 | 989 | 1320 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Package structure and manufacturing method thereof6 Oct 2026US 12,757,706 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Package structures and methods of manufacturing the same6 Oct 2026US 12,757,734 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Package substrate with open air gap structures6 Oct 2026US 12,757,739 B2Intel Corporation
- Single layer and multilayer magnetic inductors between substrate cores6 Oct 2026US 12,757,740 B2Intel Corporation
- Method for manufacturing wiring board, method for manufacturing semiconductor device, and resin sheet6 Oct 2026US 12,757,747 B2
- Semiconductor packages and methods of manufacturing thereof8 Oct 2026US 2026/0314284 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Lid Structure With Openings To Alleviate Leakage Of Thermal Interface Material Of A Chip Assembly8 Oct 2026US 2026/0314397 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device8 Oct 2026US 2026/0314398 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Two-sided liquid cooling8 Oct 2026US 2026/0314413 A1Adeia Semiconductor Bonding Technologies Inc.
- Semiconductor package and method of manufacturing semiconductor package8 Oct 2026US 2026/0314417 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Methods and apparatus of wafer level package for heterogeneous integration technology1,051US 9,111,949 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Fan-out interconnect structure and method for forming same1,030US 9,368,460 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- 3D packages and methods for forming the same974US 9,299,649 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Packaging methods and structures using a die attach film854US 9,064,879 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Thin film electrical component781US 5,108,819 AEli Lilly and Company · 1992