H10W 70/688
Flexible insulating substrates
Official title: {Flexible insulating substrates}
H10W70/688 (Flexible insulating substrates) appears on 2,903 US grants and 2,851 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,903
- Published applications
- 2,851
- Assignees
- 802
- Inventors
- 5,065
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 6 | 0 |
| 1984 | 5 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 8 | 0 |
| 1988 | 7 | 0 |
| 1989 | 12 | 0 |
| 1990 | 14 | 0 |
| 1991 | 27 | 0 |
| 1992 | 29 | 0 |
| 1993 | 24 | 0 |
| 1994 | 38 | 0 |
| 1995 | 36 | 0 |
| 1996 | 27 | 0 |
| 1997 | 51 | 0 |
| 1998 | 57 | 0 |
| 1999 | 70 | 0 |
| 2000 | 60 | 0 |
| 2001 | 92 | 69 |
| 2002 | 115 | 105 |
| 2003 | 94 | 96 |
| 2004 | 73 | 137 |
| 2005 | 94 | 159 |
| 2006 | 98 | 145 |
| 2007 | 106 | 139 |
| 2008 | 79 | 120 |
| 2009 | 84 | 95 |
| 2010 | 98 | 89 |
| 2011 | 62 | 61 |
| 2012 | 81 | 82 |
| 2013 | 65 | 69 |
| 2014 | 69 | 73 |
| 2015 | 64 | 82 |
| 2016 | 79 | 98 |
| 2017 | 87 | 117 |
| 2018 | 103 | 150 |
| 2019 | 143 | 168 |
| 2020 | 134 | 162 |
| 2021 | 140 | 166 |
| 2022 | 121 | 135 |
| 2023 | 104 | 126 |
| 2024 | 91 | 107 |
| 2025 | 83 | 68 |
| 2026 | 59 | 33 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package and semiconductor package assembly with edge side interconnection29 Sep 2026US 12,751,308 B2Etron Technology, Inc.
- Chip-on-film package and display device including the same8 Sep 2026US 12,733,502 B2Lx Semicon Co., Ltd.
- Chip module and method of forming same1 Sep 2026US 12,727,500 B2Act Identity Technology Limited
- Varied ball ball-grid-array (BGA) packages1 Sep 2026US 12,727,523 B2Intel Corporation
- Semiconductor package and system including semiconductor package25 Aug 2026US 12,721,224 B2Samsung Electronics Co., Ltd.
- Display device and method of manufacturing the same1 Oct 2026US 2026/0301629 A1Samsung Display Co., Ltd.
- Semiconductor package including heat dissipation layers24 Sep 2026US 2026/0293672 A1Samsung Electronics Co., Ltd.
- Display device24 Sep 2026US 2026/0293774 A1LG Display Co., Ltd.
- Varied ball ball-grid-array (bga) packages24 Sep 2026US 2026/0293779 A1Intel Foundry IP LLC
- Flexible diamond heat spreader17 Sep 2026US 2026/0282908 A1Meta Platforms Technologies, LLC
Most cited
By later US patents
- Thin film electrical component781US 5,108,819 AEli Lilly and Company · 1992
- Semiconductor chip assemblies with fan-in leads734US 5,148,265 AIST Associates, Inc. · 1992
- Semiconductor chip assemblies having interposer and flexible lead719US 5,148,266 AIST Associates, Inc. · 1992
- Through silicon via, folded flex microelectronic package562US 6,924,551 B2Intel Corporation · 2005
- Stretchable form of single crystal silicon for high performance electronics on rubber substrates525US 7,521,292 B2The Board of Trustees of the University of Illinois · 2009