US 12,733,502 B2 · Chip-on-film package and display device including the same

Abstract

Disclosed is a chip-on-film package capable of preventing damage to a surface thereof. The chip-on-film package includes a flexible base film, a first metal wiring layer formed on a first surface of the base film, a first surface insulating layer formed on the first metal wiring layer, a semiconductor chip connected to the first metal wiring layer through an opening formed in the first surface insulating layer, and a spacer formed on the first surface insulating layer within a target area, which is an area within which the first surface insulating layer and a structure of a display panel contact each other. At least one groove is formed in the first surface insulating layer within the target area, and the spacer includes a first spacer filled in the groove.

Claims20

Dependent claims

A chip-on-film package comprising:

a flexible base film;
a first metal wiring layer formed on a first surface of the base film;
a first surface insulating layer formed on the first metal wiring layer;
a semiconductor chip connected to the first metal wiring layer through an opening formed in the first surface insulating layer;
and
a spacer formed on the first surface insulating layer within a target area, the target area being an area within which the first surface insulating layer and a structure of a display panel contact each other,
wherein at least one groove is formed in the first surface insulating layer within the target area, and
wherein the spacer comprises a first spacer filled in the at least one groove.

5 more elements

Dependencies are inferred from the claim text.

Chip-on-film package and display device including the same

Life of this patent

Chip-on-film package and display device including the same

Life of this patent

Abstract

Claims20