Semiconductor package and system including semiconductor package

A semiconductor package comprising:

• a substrate including first and second regions and a third region disposed between the first and second regions to connect the first and second regions, a bottom surface of the first region being in direct contact with a top surface of the second region and the substrate including a plurality of redistribution layers;
• a first semiconductor chip on a first side of the first region;
• and
• a second semiconductor chip on a first side of the second region,
• wherein the third region of the substrate is bent such that second sides opposite to the first sides of the first and second regions are in contact with each other.

A system comprising:

• a printed circuit board;
• and
• a semiconductor package bonded to the printed circuit board,
• wherein the semiconductor package includes:
• a substrate including a first region including a plurality of first redistribution layers, a second region in contact with the first region, the second region including a plurality of second redistribution layers, and a third region extending from each of the first and second regions and including a bend to connect the first and second regions to each other, the third region including a plurality of third redistribution layers;
• a first semiconductor chip on a first side opposite to a second side of the first region in contact with the second region;
• a second semiconductor chip disposed on first a side opposite to a second side of the second region in contact with the first region;
• a first molding member on the first region, the first molding member covering at least a portion of the first semiconductor chip;
• and
• a second molding member on the second region, the second molding member covering at least a portion of the second semiconductor chip,
• wherein a plurality of pads, electrically connected to at least a portion of the plurality of third redistribution layers, are on a convex outermost surface of the third region at the bend, and
• the semiconductor package is bonded to the printed circuit board through a plurality of connection members respectively connected to the plurality of pads.