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US 2026/0282908 A1Published application
Flexible diamond heat spreader
AssigneeMeta Platforms Technologies, LLC
InventorNazila Dadvand
Life of this patent
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Abstract
A device of the subject technology includes at least one semiconductor package formed on a substrate, and a diamond heat spreader arranged over the at least one semiconductor package. The substrate and the diamond heat spreader are flexible.
Claims20
A device comprising:
- at least one semiconductor package formed on a substrate;
- and
- a diamond heat spreader arranged over the at least one semiconductor package,
- wherein the substrate and the diamond heat spreader are flexible.
1 more element
A method comprising:
- forming a layer of diamond over a flexible substrate;
- treating a first surface of the layer of diamond using an oxygen plasma;
- and
- forming a first encapsulating layer on the treated first surface of the layer of diamond.
1 more element
A wearable device comprising:
- at least one semiconductor package including electronic circuitry formed on a substrate;
- and
- a diamond heat spreader arranged over the at least one semiconductor package,
- wherein the substrate and the diamond heat spreader are flexible.
1 more element
Dependencies are inferred from the claim text.