Chip module and method of forming same

A chip module including:

• an integrated-circuit (IC) chip, a first substrate layer made at least partly of a flexible material and with a first hole, a second substrate layer made at least partly of an adhesive material and with a second hole, and a third substrate layer made at least partly of an electrically conductive material, wherein said second substrate layer is sandwiched between and fixedly engaged with said first substrate layer and said third substrate layer, wherein said first hole of said first substrate layer and said second hole of said second substrate layer are aligned with each other to form a first cavity, and wherein at least a first part of said IC chip is received within said first cavity, further including a fourth substrate layer made at least partly of an adhesive material and with a third hole and a fifth substrate layer with a fourth hole, and wherein said third hole and said fourth hole are aligned with each other to form a second cavity, and wherein at least a second part of said IC chip is received within said second cavity.

A method of forming a chip module including:

• providing a first substrate layer made at least partly of a flexible material and with a plurality of first holes, providing a second substrate layer made at least partly of an adhesive material and with a plurality of second holes, providing a third substrate layer made at least partly of an electrically conductive material, aligning said first holes of said first substrate layer with said second holes of said second substrate layer to form a plurality of first cavities, sandwiching said second substrate layer between said first substrate layer and said third substrate layer, fixedly engaging said first substrate layer, said second substrate layer and said third substrate layer to form a first layered structure, fixedly engaging at least a first part of an integrated-circuit (IC) chip within one of said first cavities of said first layered structure, and cutting out at least one chip module from said first layered structure fixedly engaged with said IC chip, including engaging a leg of said IC chip with at least one slit of said third substrate layer to electrically connect said IC chip with said third substrate layer.

A method of forming a chip module including:

• providing a first substrate layer made at least partly of a flexible material and with a plurality of first holes, providing a second substrate layer made at least partly of an adhesive material and with a plurality of second holes, providing a third substrate layer made at least partly of an electrically conductive material, aligning said first holes of said first substrate layer with said second holes of said second substrate layer to form a plurality of first cavities, sandwiching said second substrate layer between said first substrate layer and said third substrate layer, fixedly engaging said first substrate layer, said second substrate layer and said third substrate layer to form a first layered structure, fixedly engaging at least a first part of an integrated-circuit (IC) chip within one of said first cavities of said first layered structure, and cutting out at least one chip module from said first layered structure fixedly engaged with said IC chip, further including providing a fourth substrate layer made at least partly of an adhesive material and with a plurality of third holes and a fifth substrate layer with a plurality of fourth holes, and further including fixedly engaging said fourth adhesive substrate layer and said fifth substrate layer with said first layered structure to form a second layered structure.