H10W 70/69
Insulating materials thereof
H10W70/69 (Insulating materials thereof) appears on 6,481 US grants and 8,046 published applications in this corpus.
Search patents in H10W- Granted patents
- 6,481
- Published applications
- 8,046
- Assignees
- 1,280
- Inventors
- 11,898
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 3 | 0 |
| 1978 | 7 | 0 |
| 1979 | 12 | 0 |
| 1980 | 5 | 0 |
| 1981 | 12 | 0 |
| 1982 | 16 | 0 |
| 1983 | 13 | 0 |
| 1984 | 15 | 0 |
| 1985 | 19 | 0 |
| 1986 | 22 | 0 |
| 1987 | 46 | 0 |
| 1988 | 35 | 0 |
| 1989 | 34 | 0 |
| 1990 | 30 | 0 |
| 1991 | 49 | 0 |
| 1992 | 58 | 0 |
| 1993 | 52 | 0 |
| 1994 | 41 | 0 |
| 1995 | 28 | 0 |
| 1996 | 41 | 0 |
| 1997 | 48 | 0 |
| 1998 | 77 | 0 |
| 1999 | 78 | 0 |
| 2000 | 61 | 0 |
| 2001 | 70 | 32 |
| 2002 | 74 | 99 |
| 2003 | 82 | 91 |
| 2004 | 83 | 104 |
| 2005 | 69 | 116 |
| 2006 | 72 | 110 |
| 2007 | 76 | 102 |
| 2008 | 65 | 122 |
| 2009 | 61 | 107 |
| 2010 | 86 | 124 |
| 2011 | 101 | 152 |
| 2012 | 117 | 215 |
| 2013 | 167 | 255 |
| 2014 | 215 | 335 |
| 2015 | 283 | 348 |
| 2016 | 331 | 376 |
| 2017 | 369 | 410 |
| 2018 | 364 | 405 |
| 2019 | 374 | 459 |
| 2020 | 368 | 512 |
| 2021 | 396 | 566 |
| 2022 | 427 | 544 |
| 2023 | 380 | 541 |
| 2024 | 395 | 687 |
| 2025 | 384 | 639 |
| 2026 | 266 | 595 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Package substrate with open air gap structures6 Oct 2026US 12,757,739 B2Intel Corporation
- Single layer and multilayer magnetic inductors between substrate cores6 Oct 2026US 12,757,740 B2Intel Corporation
- Asymmetrical dielectric-to-metal adhesion architecture for electronic packages6 Oct 2026US 12,757,760 B2Intel Corporation
- Semiconductor package6 Oct 2026US 12,757,763 B2Samsung Electronics Co., Ltd.
- Semiconductor device6 Oct 2026US 12,757,766 B2Rohm Co., Ltd.
- Semiconductor packages and methods of manufacturing thereof8 Oct 2026US 2026/0314284 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device8 Oct 2026US 2026/0314398 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Interposer via interconnect shapes with improved performance characteristics and methods of forming the same8 Oct 2026US 2026/0314453 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package8 Oct 2026US 2026/0314457 A1Samsung Electronics Co., Ltd.
- Semiconductor device and method8 Oct 2026US 2026/0314458 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Methods and apparatus of wafer level package for heterogeneous integration technology1,051US 9,111,949 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Fan-out interconnect structure and method for forming same1,030US 9,368,460 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- 3D packages and methods for forming the same974US 9,299,649 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Packaging methods and structures using a die attach film854US 9,064,879 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Thin film electrical component781US 5,108,819 AEli Lilly and Company · 1992