H10W 70/698
Semiconductor materials that are electrically insulating
Official title: Semiconductor materials that are electrically insulating, e.g. undoped silicon
H10W70/698 (Semiconductor materials that are electrically insulating) appears on 1,494 US grants and 1,881 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,494
- Published applications
- 1,881
- Assignees
- 386
- Inventors
- 2,669
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 5 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 8 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 7 | 0 |
| 1991 | 12 | 0 |
| 1992 | 5 | 0 |
| 1993 | 4 | 0 |
| 1994 | 7 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 5 | 0 |
| 1998 | 6 | 0 |
| 1999 | 7 | 0 |
| 2000 | 5 | 0 |
| 2001 | 1 | 2 |
| 2002 | 3 | 10 |
| 2003 | 10 | 6 |
| 2004 | 16 | 15 |
| 2005 | 7 | 25 |
| 2006 | 18 | 27 |
| 2007 | 20 | 29 |
| 2008 | 16 | 41 |
| 2009 | 16 | 27 |
| 2010 | 26 | 33 |
| 2011 | 31 | 63 |
| 2012 | 42 | 92 |
| 2013 | 64 | 74 |
| 2014 | 78 | 117 |
| 2015 | 105 | 101 |
| 2016 | 101 | 83 |
| 2017 | 92 | 81 |
| 2018 | 85 | 82 |
| 2019 | 84 | 87 |
| 2020 | 89 | 108 |
| 2021 | 73 | 112 |
| 2022 | 87 | 122 |
| 2023 | 83 | 140 |
| 2024 | 110 | 124 |
| 2025 | 99 | 126 |
| 2026 | 43 | 154 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Composite substrate, manufacturing method thereof, and semiconductor device6 Oct 2026US 12,757,772 B2Enkris Semiconductor, Inc.
- Hybrid organic and non-organic interposer with embedded component in molding structure and methods for forming the same15 Sep 2026US 12,740,463 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and method8 Sep 2026US 12,733,526 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Interposer with capacitors1 Sep 2026US 12,727,484 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Quantum device25 Aug 2026US 12,721,049 B2NEC Corporation
- Semiconductor packages and methods of manufacturing thereof8 Oct 2026US 2026/0314284 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package8 Oct 2026US 2026/0314457 A1Samsung Electronics Co., Ltd.
- Semiconductor device and method8 Oct 2026US 2026/0314458 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package1 Oct 2026US 2026/0305346 A1DeepWave, Inc.
- Bridge chiplet shield structures1 Oct 2026US 2026/0305352 A1Intel Corporation
Most cited
By later US patents
- Packaging methods and structures using a die attach film854US 9,064,879 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Method for fabricating stackable chip scale semiconductor package676US 6,235,554 B1Micron Technology, Inc. · 2001
- Single piece package for semiconductor die528US 5,739,585 AMicron Technology, Inc. · 1998
- Method for fabricating self-assembling microstructures513US 5,545,291 AThe Regents of the University of California · 1996
- Stackable chip scale semiconductor package with mating contacts on opposed surfaces457US 6,013,948 AMicron Technology, Inc. · 2000