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US 2026/0305352 A1Published application
Bridge chiplet shield structures
AssigneeIntel Corporation
InventorAndrew Collins
Life of this patent
Estimating the term…
Abstract
Microelectronic integrated circuit package structures include a substrate comprising an IC die on a surface of the substrate, where a first edge of a bridge die is below a portion of the IC die and is embedded within the substrate. The bridge die is coupled to the IC die, and a dummy die is adjacent to the IC die on the substrate, where a second edge of the bridge die is below the dummy die.
Claims20
An apparatus, comprising:
- a substrate comprising a first side and a second side opposite the first side;
- a dummy die comprising a first edge and a second edge, wherein the dummy die is on the first side of the substrate;
- a device die on the first side of the substrate, adjacent to the first edge of the dummy die;
- and
- a bridge die, wherein a first portion of the bridge die is below the device die and a second portion of the bridge die is below dummy die, and wherein the second edge of the dummy die is beyond an edge of the bridge die.
2 more elements
An apparatus, comprising:
- a substrate;
- a dummy die comprising a first edge and a second edge, wherein the dummy die is on a surface of the substrate;
- a device die adjacent to the second edge of the dummy die;
- an underfill material on the first edge of the dummy die;
- and
- a bridge die comprising a first bridge edge and a second bridge edge, wherein the first bridge edge is separated from the first edge of the dummy die by greater than 0.5 micron.
3 more elements
A method, comprising:
- receiving a substrate comprising an IC die on a surface of the substrate, wherein a first edge of a bridge die is below a portion of the IC die, wherein the bridge die is coupled to the IC die;
- placing a dummy die adjacent to the IC die, wherein a second edge of the bridge die is below the dummy die;
- and
- forming an underfill material on a sidewall of the dummy die.
1 more element
Dependencies are inferred from the claim text.