H10W 70/695
Organic materials
H10W70/695 (Organic materials) appears on 1,308 US grants and 1,616 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,308
- Published applications
- 1,616
- Assignees
- 413
- Inventors
- 3,276
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 8 | 0 |
| 1980 | 0 | 0 |
| 1981 | 3 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 6 | 0 |
| 1985 | 3 | 0 |
| 1986 | 4 | 0 |
| 1987 | 9 | 0 |
| 1988 | 7 | 0 |
| 1989 | 10 | 0 |
| 1990 | 2 | 0 |
| 1991 | 5 | 0 |
| 1992 | 14 | 0 |
| 1993 | 15 | 0 |
| 1994 | 10 | 0 |
| 1995 | 8 | 0 |
| 1996 | 11 | 0 |
| 1997 | 10 | 0 |
| 1998 | 15 | 0 |
| 1999 | 15 | 0 |
| 2000 | 14 | 0 |
| 2001 | 14 | 4 |
| 2002 | 13 | 17 |
| 2003 | 12 | 17 |
| 2004 | 11 | 19 |
| 2005 | 8 | 22 |
| 2006 | 18 | 18 |
| 2007 | 10 | 12 |
| 2008 | 9 | 18 |
| 2009 | 8 | 24 |
| 2010 | 12 | 15 |
| 2011 | 12 | 16 |
| 2012 | 17 | 23 |
| 2013 | 20 | 37 |
| 2014 | 25 | 40 |
| 2015 | 25 | 64 |
| 2016 | 46 | 52 |
| 2017 | 54 | 74 |
| 2018 | 55 | 75 |
| 2019 | 61 | 126 |
| 2020 | 92 | 145 |
| 2021 | 120 | 219 |
| 2022 | 153 | 140 |
| 2023 | 121 | 109 |
| 2024 | 105 | 112 |
| 2025 | 65 | 111 |
| 2026 | 49 | 107 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Chip-on-wafer-on-board structure using spacer die and methods of forming the same29 Sep 2026US 12,751,320 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Scalable extreme large size substrate integration22 Sep 2026US 12,745,661 B2Apple Inc.
- Multi-chip high memory bandwidth configuration22 Sep 2026US 12,745,683 B2International Business Machines Corporation
- Hybrid organic and non-organic interposer with embedded component in molding structure and methods for forming the same15 Sep 2026US 12,740,463 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor devices methods of manufacturing semiconductor devices8 Sep 2026US 12,733,522 B2Amkor Technology Singapore Holding Pte.Ltd.
- Interposer via interconnect shapes with improved performance characteristics and methods of forming the same8 Oct 2026US 2026/0314453 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Resin composition, prepreg, resin film, metal-clad laminated plate, printed wiring board, and semiconductor package1 Oct 2026US 2026/0297317 A1Resonac Corporation
- Photosensitive resin composition, resin film having pattern, method for producing resin film having pattern, and semiconductor circuit board1 Oct 2026US 2026/0299411 A1Jsr Corporation
- Photosensitive resin composition, cured product, and semiconductor element1 Oct 2026US 2026/0299412 A1
- Package substrate with a mold extension1 Oct 2026US 2026/0305392 A1Intel Corporation
Most cited
By later US patents
- Thin film electrical component781US 5,108,819 AEli Lilly and Company · 1992
- Method of making a thin film electrical component396US 5,403,700 AEli Lilly and Company · 1995
- High performance semiconductor package assembly236US 4,322,778 AInternational Business Machines Corporation · 1982
- Semiconductor device having a particular conductive lead structure228US 5,157,475 AOki Electric Industry Co., Ltd. · 1992
- Area array semiconductor device having a lid with functional contacts194US 5,291,062 AMotorola, Inc. · 1994