Area array semiconductor device having a lid with functional contacts

An area array semiconductor device comprising:

• a polymeric substrate having a first plurality of conductive traces on a first surface and a die cavity;
• a semiconductor die having an active surface and an inactive surface, wherein the inactive surface is bonded to the substrate in the die cavity;
• a plurality of electrical connections connecting the active surface of the semiconductor die to the first plurality of conductive traces, defining a contact area;
• and
• a polymeric lid covering the semiconductor die and the substrate, wherein the lid has a cavity of an area at least as large as the contact area and the die cavity to provide a clearance for the semiconductor die and the plurality of electrical connections, the lid having a second plurality of conductive traces on a second surface which is electrically interconnected to an area array of contact pads on a third surface, wherein the area array of contact pads substantially populates the third surface;
• and
• an anisotropic z-axis conductive adhesive which seals the lid to the substrate and electrically connects the second plurality of conductive traces on the lid to the first plurality of conductive traces on the substrate.

An area array semiconductor device comprising:

• a polymeric substrate having a bonding shelf, a lid contact shelf, a die cavity, and a first plurality of conductive traces which extends from the bonding shelf to the lid contact shelf;
• a semiconductor die having an active surface and an inactive surface, wherein the inactive surface is bonded to the substrate in the die cavity;
• a plurality of electrical connections connecting the active surface of the semiconductor die to the first plurality of conductive traces on the bonding shelf;
• and
• a polymeric lid covering the semiconductor die and a portion of the substrate, the lid having a second plurality of conductive traces on a first surface which is electrically interconnected to an area array of contact pads on a second surface, wherein the area array of contact pads substantially populates the second surface;
• and
• an anisotropic z-axis conductive adhesive which seals the lid to the substrate and electrically connects the second plurality of conductive traces on the lid to the first plurality of conductive traces on the lid contact shelf of the substrate.