Scalable extreme large size substrate integration

An electronic package comprising:

• a package substrate that has a first maximum width in a first direction between first laterally opposite edges of the package substrate;
• an organic interposer bonded to the package substrate with a conductive film to electrically connect a plurality of contact pads of the organic interposer to a corresponding plurality of landing pads of the package substrate;
• wherein the organic interposer includes a plurality of polymer dielectric layers, a first plurality of first metal redistribution lines, and a lower rigid layer that is thicker than each of the plurality of polymer dielectric layers or is formed of a different material than each of the plurality of polymer dielectric layers;
• wherein the organic interposer has a second maximum width in the first direction between second laterally opposite edges of the organic interposer, and the second maximum width is less than the first maximum width;
• wherein the conductive film includes an electrically conductive material dispersed in an adhesive insulator matrix;
• and
• one or more dies bonded to a top side of the organic interposer.