H10W 70/692
Ceramics or glasses
H10W70/692 (Ceramics or glasses) appears on 1,863 US grants and 2,569 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,863
- Published applications
- 2,569
- Assignees
- 582
- Inventors
- 4,246
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 6 | 0 |
| 1979 | 4 | 0 |
| 1980 | 4 | 0 |
| 1981 | 3 | 0 |
| 1982 | 11 | 0 |
| 1983 | 8 | 0 |
| 1984 | 5 | 0 |
| 1985 | 15 | 0 |
| 1986 | 14 | 0 |
| 1987 | 29 | 0 |
| 1988 | 24 | 0 |
| 1989 | 21 | 0 |
| 1990 | 19 | 0 |
| 1991 | 22 | 0 |
| 1992 | 19 | 0 |
| 1993 | 20 | 0 |
| 1994 | 17 | 0 |
| 1995 | 8 | 0 |
| 1996 | 11 | 0 |
| 1997 | 15 | 0 |
| 1998 | 26 | 0 |
| 1999 | 23 | 0 |
| 2000 | 23 | 0 |
| 2001 | 24 | 10 |
| 2002 | 18 | 21 |
| 2003 | 19 | 30 |
| 2004 | 21 | 21 |
| 2005 | 18 | 24 |
| 2006 | 12 | 27 |
| 2007 | 21 | 30 |
| 2008 | 15 | 22 |
| 2009 | 19 | 24 |
| 2010 | 21 | 26 |
| 2011 | 21 | 26 |
| 2012 | 15 | 36 |
| 2013 | 32 | 54 |
| 2014 | 39 | 61 |
| 2015 | 81 | 73 |
| 2016 | 70 | 91 |
| 2017 | 76 | 111 |
| 2018 | 84 | 110 |
| 2019 | 92 | 151 |
| 2020 | 97 | 156 |
| 2021 | 130 | 154 |
| 2022 | 118 | 192 |
| 2023 | 104 | 198 |
| 2024 | 130 | 295 |
| 2025 | 145 | 285 |
| 2026 | 92 | 341 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Single layer and multilayer magnetic inductors between substrate cores6 Oct 2026US 12,757,740 B2Intel Corporation
- Wireless interconnects in integrated circuit package substrates with glass cores29 Sep 2026US 12,749,798 B2Intel Corporation
- Die bonding structure and method of manufacturing the same29 Sep 2026US 12,751,124 B2Materials Technology Corporation
- Method of manufacturing packaging substrate and packaging substrate manufactured thereby29 Sep 2026US 12,751,303 B2Absolics Inc.
- Metal thin film substrate, transparent display comprising same, method for patterning metal thin film substrate, and method for manufacturing transparent display22 Sep 2026US 12,741,445 B2Dongwoo Fine-Chem Co., Ltd.
- Power semiconductor module and method of manufacturing the same1 Oct 2026US 2026/0305335 A1Infineon Technologies AG
- Single layer and multilayer magnetic inductors between substrate cores1 Oct 2026US 2026/0305365 A1Intel Foundry IP LLC
- Package substrate with a mold extension and z-height reset layer1 Oct 2026US 2026/0305391 A1Intel Corporation
- Package substrate with a mold extension1 Oct 2026US 2026/0305392 A1Intel Corporation
- Semiconductor structure and methods of manufacturing the same1 Oct 2026US 2026/0305394 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Aluminum nitride-based sintered bodies, corrosion-resistant members, metal-buried articles and semiconductor-holding apparatuses320US 6,239,402 B1NGK Insulators, Ltd. · 2001
- Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies177US 9,824,974 B2Invensas Corporation · 2017
- Inverted chip bonded module with high packaging efficiency130US 5,627,406 A1997
- Capacitive chip carrier and multilayer ceramic capacitors124US 4,349,862 AInternational Business Machines Corporation · 1982
- Installation of a semiconductor chip on a glass substrate117US 4,190,855 ASharp Kabushiki Kaisha · 1980