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US 12,749,798 B2Granted
Wireless interconnects in integrated circuit package substrates with glass cores
AssigneeIntel Corporation
InventorsTolga Acikalin, Tae Young Yang, Shuhei Yamada, Telesphor Kamgaing
Life of this patent
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Abstract
Wireless interconnects in integrated circuit package substrates with glass cores are disclosed. An example apparatus includes a semiconductor die. The example apparatus further includes a package substrate supporting the semiconductor die. The package substrate includes a glass core. The example apparatus also includes an antenna within the glass core.
Claims19
An apparatus comprising:
- a semiconductor die;
- a package substrate supporting the semiconductor die, the package substrate including a glass core, the glass core having a first surface and a second surface opposite the first surface;
- and
- an antenna, at least part of the antenna between the first and second surfaces of the glass core, the antenna including a radiator and a reflector, the radiator corresponding to a first through-glass via in the glass core, the reflector corresponding to a second through-glass via in the glass core.
1 more element
An apparatus comprising:
- a semiconductor die;
- a package substrate supporting the semiconductor die, the package substrate including a glass core, the glass core having a first surface and a second surface opposite the first surface;
- and
- an antenna, at least part of the antenna between the first and second surfaces of the glass core, the antenna proximate to an edge of the package substrate, the antenna pointing away from a center of the package substrate.
1 more element
An apparatus comprising:
- a semiconductor die;
- a package substrate supporting the semiconductor die, the package substrate including a glass core, the glass core having a first surface and a second surface opposite the first surface;
- and
- an antenna, at least part of the antenna between the first and second surfaces of the glass core, the antenna including a horn surrounding a radiator.
1 more element
An apparatus comprising:
- a glass core of a package substrate;
- a first build-up region on a first side of the glass core;
- a second build-up region on a second side of the glass core;
- and
- an antenna at least partially embedded within and in contact with the glass core, the antenna proximate to an edge of the package substrate, the antenna pointing away from a center of the package substrate.
2 more elements
An integrated circuit package comprising:
- a semiconductor die;
- a package substrate supporting the semiconductor die, the package substrate including means for strengthening the package substrate;
- means for radiating a wireless signal, the means for radiating within the means for strengthening;
- and
- means for reflecting the wireless signal, the means for reflecting within the means for radiating.
2 more elements
Dependencies are inferred from the claim text.