Installation of a semiconductor chip on a glass substrate

A semiconductor device comprising:

• (a) a flipchip integrated circuit device having a specific coefficient of thermal expansion;
• (b) a mechanical supporting substrate which has a coefficient of thermal expansion substantially different from that of said flipchip and bears a low mechanical resistance against thermal expansion;
• (c) a wiring pattern deposited on said supporting substrate;
• (d) a bonding member for bounding said flipchip integrated circuit device and said substrate, said flipchip integrated circuit device being mechanically supported by the bonding member;
• and
• (e) an insulating resin layer deposited in such a manner so as to cover at least a junction between said flipchip integrated circuit device and said bonding member and a junction between said substrate and said bonding member, said insulating resin layer having a coefficient of thermal expansion sufficient to absorb mechanical strain caused by the differences in the coefficient of thermal expansion between said flipchip integrated circuit and said substrate, thereby ensuring the mechanical tightness of the junctions between said flipchip integrated circuit device and said bonding member and between said substrate and said bonding member against a substantial amount of thermal expansion.